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IRF7799L2PBF Datasheet, PDF (3/11 Pages) International Rectifier – RoHS Compliant, Halogen Free | |||
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IRF7799L2PbF
Absolute Maximum Ratings
PD @TC = 25°C
PD @TC = 100°C
PD @TA = 25°C
TP
TJ
TSTG
f Power Dissipation
f Power Dissipation
c Power Dissipation
Parameter
Peak Soldering Temperature
Operating Junction and
Storage Temperature Range
Thermal Resistance
RθJA
RθJA
RθJA
RθJ-can
e Junction-to-Ambient
j Junction-to-Ambient
k Junction-to-Ambient
fl Junction-to-Can
Parameter
RθJ-PCB
Junction-to-PCB Mounted
Max.
125
63
4.3
270
-55 to + 175
Typ.
âââ
12.5
20
âââ
âââ
Max.
35
âââ
âââ
1.2
0.5
Units
W
°C
Units
°C/W
10
1
D = 0.50
0.1
0.01
0.001
1E-006
0.20
0.10
0.05
0.02
0.01
SINGLE PULSE
( THERMAL RESPONSE )
1E-005
0.0001
ÏJ ÏJ
Ï1 Ï1
R1R1
Ci= Ïi/Ri
Ci i/Ri
R2R2
Ï2 Ï2
Ri (°C/W)
ÏCÏ 0.38829
0.8117
Ïi (sec)
0.000787
0.006586
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthjc + Tc
0.001
0.01
0.1
1
t1 , Rectangular Pulse Duration (sec)
Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Case Â
Notes:
 Surface mounted on 1 in. square Cu board, steady state.
 Mounted on minimum footprint full size board with metalized
 TC measured with thermocouple incontact with top (Drain) of part. back and with small clip heatsink.
 Used double sided cooling, mounting pad with large heatsink.
 Rθ is measured at TJ of approximately 90°C.
 Surface mounted on 1 in. square Cu
board (still air).
 Mounted on minimum footprint full size board with metalized
back and with small clip heatsink. (still air)
3
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February 24, 2014
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