IRF7799L2PBF Datasheet, PDF (1/11 Pages) International Rectifier – RoHS Compliant, Halogen Free

IRF7799L2PbF
l RoHS Compliant, Halogen Free 
l Lead-Free (Qualified up to 260°C Reflow)
l Ideal for High Performance Isolated Converter
Primary Switch Socket
l Optimized for Synchronous Rectification
l Low Conduction Losses
l High Cdv/dt Immunity
l Low Profile (<0.7mm)
l Dual Sided Cooling Compatible 
l Compatible with existing Surface Mount Techniques
l Industrial Qualified
Applicable DirectFET Outline and Substrate Outline 
DirectFET™ Power MOSFET ‚
Typical values (unless otherwise specified)
V_DSS
V_GS
250V min ± 30V max
Q_{g tot}
Q_gd
110nC 39nC
R_DS(on)
32mΩ@ 10V
V_gs(th)
4.0V
S
S
D
G
S
S
S
S
S
D
S
L8
DirectFET™ ISOMETRIC
SB
SC
M2
M4
L4
L6
L8
Description
The IRF7799L2TR/TR1PbF combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFET^TM packaging to achieve the
lowest on-state resistance in a package that has a footprint smaller than a D²PAK and only 0.7 mm profile. The DirectFET package is compatible with existing
layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques, when application
note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET package allows dual sided cooling to maximize thermal transfer
in power systems.
The IRF7799L2TR/TR1PbF is optimized for high frequency switching and synchronous rectification applications. The reduced total losses in the device
coupled with the high level of thermal performance enables high efficiency and low temperatures, which are key for system reliability improvements, and
makes this device ideal for high performance power converters.
Orderable part number
IRF7799L2TRPbF
IRF7799L2TR1PbF
Package Type
DirectFET2 Large Can
DirectFET2 Large Can
Standard Pack
Form
Quantity
Tape and Reel
4000
Tape and Reel
1000
Note
"TR" suffix
"TR1" suffix EOL notice # 264
Absolute Maximum Ratings
Parameter
V_DS
Drain-to-Source Voltage
V_GS
I_D @ T_C = 25°C
I_D @ T_C = 100°C
I_D @ T_A = 25°C
I_D @ T_C = 25°C
I_DM
E_AS
I_AR
200
Gate-to-Source Voltage
f Continuous Drain Current, V_GS @ 10V (Silicon Limited)
f Continuous Drain Current, V_GS @ 10V (Silicon Limited)
e Continuous Drain Current, V_GS @ 10V (Silicon Limited)
f Continuous Drain Current, V_GS @ 10V (Package Limited)
g Pulsed Drain Current
h Single Pulse Avalanche Energy
Ãg Avalanche Current
60
180
ID = 21A
55
160
50
140
Max.
250
±30
35
25
6.6
375
140
325
21
Vgs = 7.0V
Vgs = 8.0V
Vgs = 10V
Vgs = 15V
TJ = 25°C
Units
V
A
mJ
A
120
45
100
40
80
60
40
20
4
TJ = 125°C
TJ = 25°C
8
12
16
20
35
30
25
0
20
40
60
80
100
VGS, Gate -to -Source Voltage (V)
Notes:
Fig 1. Typical On-Resistance vs. Gate Voltage
 Click on this section to link to the appropriate technical paper.
‚ Click on this section to link to the DirectFET Website.
ƒ Surface mounted on 1 in. square Cu board, steady state.
ID, Drain Current (A)
Fig 2. Typical On-Resistance vs. Drain Current
„ T_C measured with thermocouple mounted to top (Drain) of part.
… Repetitive rating; pulse width limited by max. junction temperature.
† Starting T_J = 25°C, L = 1.42mH, R_G = 25Ω, I_AS = 21A.
‡ Pulse width ≤ 400μs; duty cycle ≤ 2%.
1
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February 24, 2014