IRF7748L1PBF Datasheet, PDF (3/10 Pages) International Rectifier – DirectFET™ Power MOSFET

Absolute Maximum Ratings
Symbol
Parameter
P_D @T_C = 25°C Power Dissipation 
P_D @T_C = 100°C Power Dissipation 
P_D @T_A = 25°C Power Dissipation 
T_P
Peak Soldering Temperature
T_J
Operating Junction and
T_STG
Storage Temperature Range
Thermal Resistance
Symbol
Parameter
R_qJA
R_qJA
R_qJA
R_qJC
R_qJA-PCB
Junction-to-Ambient 
Junction-to-Ambient 
Junction-to-Ambient 
Junction-to-Can 
Junction-to-PCB Mounted
10
IRF7748L1TRPbF
Max.
94
47
3.3
270
-55 to + 175
Units
W
°C
Typ.
–––
12.5
20
–––
–––
Max.
45
–––
–––
1.6
0.5
Units
°C/W
1
0.1
0.01
0.001
1E-006
D = 0.50
0.20
0.10
0.05
0.02
0.01
SINGLE PULSE
( THERMAL RESPONSE )
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthjc + Tc
1E-005
0.0001
0.001
0.01
0.1
1
t1 , Rectangular Pulse Duration (sec)
Notes:
Fig 3. Maximum Effec ve Transient Thermal Impedance, Junc on‐to‐Case
 Surface mounted on 1 in. square Cu board, steady state.
 T_C measured with thermocouple incontact with top (Drain) of part.
 Repetitive rating; pulse width limited by max. junction temperature.
 Used double sided cooling, mounting pad with large heatsink.
 Mounted on minimum footprint full size board with metalized
back and with small clip heatsink.
 R_ is measured at T_J of approximately 90°C.
 Surface mounted on 1 in. square Cu
board (still air).
 Mounted on minimum footprint full size board with metalized
back and with small clip heatsink (still air)
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February 18, 2013