IRF6723M2DTRPBF Datasheet, PDF (3/10 Pages) International Rectifier – Dual Common Drain Control MOSFETs for Multiphase DC-DC Converters

IRF6723M2DTR/TR1PbF
Absolute Maximum Ratings (each die operating consecutively)
P_D @T_A = 25°C
P_D @T_A = 70°C
P_D @T_C = 25°C
e Power Dissipation
e Power Dissipation
f Power Dissipation
Parameter
T_P
Peak Soldering Temperature
T_J
Operating Junction and
T_STG
Storage Temperature Range
Max.
2.7
1.9
25
270
-55 to + 175
Thermal Resistance (each die operating consecutively)
Parameter
R_θJA
R_θJA
R_θJA
R_θJC
el Junction-to-Ambient
jl Junction-to-Ambient
kl Junction-to-Ambient
fl Junction-to-Case
R_θJ-PCB
Junction-to-PCB Mounted
eà Linear Derating Factor
Typ.
–––
12.5
20
–––
1.0
0.018
Max.
56
–––
–––
5.9
–––
Units
W
°C
Units
°C/W
W/°C
100
D = 0.50
10
0.20
0.10
0.05
1
0.02
0.01
0.1
0.01
SINGLE PULSE
( THERMAL RESPONSE )
τ_{J τJ}
τ_{1 τ1}
R _{1R 1}
Ci= τi/Ri
Ci= τi/Ri
R_2R2
τ_{2 τ2}
R _{3R 3}
τ_{3 τ3}
0.001
1E-006
1E-005
0.0001
0.001
0.01
t1 , Rectangular Pulse Duration (sec)
R_{4R4 Ri (°C/W) τi (sec)}
τ_AτA 3.1440
0.000878
τ_{4 τ4}
23.201 0.291662
19.855 1.970485
9.7220 0.027200
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthja + Tc
0.1
1
10
Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient 
Notes:
ƒ Surface mounted on 1 in. square Cu board, steady state.
‰ Mounted on minimum footprint full size board with metalized
„ T_C measured with thermocouple incontact with top (Drain) of part. ^{back and with small clip heatsink.}
ˆ Used double sided cooling, mounting pad with large heatsink.
Š R_θ is measured at T_J of approximately 90°C.
ƒ Surface mounted on 1 in. square Cu
board (still air).
www.irf.com
‰ Mounted on minimum footprint full size board with metalized
back and with small clip heatsink. (still air)
3