IRF6616PBF_15 Datasheet, PDF (3/10 Pages) International Rectifier – RoHS compliant containing no lead or bormide

IRF6616PbF
Absolute Maximum Ratings
P_D @T_A = 25°C
P_D @T_A = 70°C
P_D @T_C = 25°C
T_P
T_J
T_STG
™ Power Dissipation
™ Power Dissipation
f Power Dissipation
Parameter
Peak Soldering Temperature
Operating Junction and
Storage Temperature Range
Thermal Resistance
R_θJA
R_θJA
R_θJA
R_θJC
R_θJ-PCB
Parameter
™g Junction-to-Ambient
dg Junction-to-Ambient
eg Junction-to-Ambient
fg Junction-to-Case
Junction-to-PCB Mounted
™Ã Linear Derating Factor
Max.
2.8
1.8
89
270
-40 to + 150
Typ.
–––
12.5
20
–––
1.0
0.022
Max.
45
–––
–––
1.4
–––
Units
W
°C
Units
°C/W
W/°C
100
10
1
0.1
0.01
D = 0.50
0.20
0.10
0.05
0.02
0.01
τ_{J τJ}
τ_{1 τ1}
R _{1R 1}
R_{2R 2}
τ_{2 τ2}
R _{3R 3}
τ_{3 τ3}
SINGLE PULSE
( THERMAL RESPONSE )
Ci= τi/Ri
Ci τi/Ri
0.001
1E-006
1E-005
0.0001
0.001
0.01
0.1
R _{4R 4}
τ_{4 τ4}
τ_AτA
Ri (°C/W)
1.2801
8.7256
21.750
τi (sec)
0.000322
0.164798
2.25760
13.251 69
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthja + Tc
1
10
100
t1 , Rectangular Pulse Duration (sec)
Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient
Notes:
 Surface mounted on 1 in. square Cu board, steady state.

„ T_C measured with thermocouple incontact with top (Drain) of part.
‚ Used double sided cooling , mounting pad.
ƒ Mounted on minimum footprint full size board with metalized
… R_θ is measured at T_J of approximately 90°C.
back and with small clip heatsink.
 Surface mounted on 1 in. square Cu
board (still air).
www.irf.com
ƒ Mounted to a PCB with
small clip heatsink (still air)
ƒ Mounted on minimum
footprint full size board with
metalized back and with
small clip heatsink (still air)
3