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IRFS3307PBF Datasheet, PDF (2/11 Pages) International Rectifier – High Efficiency Synchronous Rectification in SMPS
IRFB/S/SL3307PbF
Static @ TJ = 25°C (unless otherwise specified)
Symbol
Parameter
V(BR)DSS
V(BR)DSS/TJ
RDS(on)
VGS(th)
IDSS
Drain-to-Source Breakdown Voltage
Breakdown Voltage Temp. Coefficient
Static Drain-to-Source On-Resistance
Gate Threshold Voltage
Drain-to-Source Leakage Current
IGSS
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
RG
Gate Input Resistance
Min. Typ. Max. Units
Conditions
75 ––– –––
––– 0.069 –––
––– 5.0 6.3
V VGS = 0V, ID = 250μA
d V/°C Reference to 25°C, ID = 1mA
g m VGS = 10V, ID = 75A
2.0 ––– 4.0 V VDS = VGS, ID = 150μA
––– ––– 20 μA VDS = 75V, VGS = 0V
––– ––– 250
VDS = 75V, VGS = 0V, TJ = 125°C
––– ––– 200 nA VGS = 20V
––– ––– -200
VGS = -20V
––– 1.5 –––  f = 1MHz, open drain
Dynamic @ TJ = 25°C (unless otherwise specified)
Symbol
Parameter
Min.
gfs
Forward Transconductance
98
Qg
Total Gate Charge
–––
Qgs
Gate-to-Source Charge
–––
Qgd
Gate-to-Drain ("Miller") Charge
–––
td(on)
Turn-On Delay Time
–––
tr
Rise Time
–––
td(off)
Turn-Off Delay Time
–––
tf
Fall Time
–––
Ciss
Input Capacitance
–––
Coss
Output Capacitance
–––
Crss
Reverse Transfer Capacitance
–––
h Coss eff. (ER) Effective Output Capacitance (Energy Related) –––
Coss eff. (TR) Effective Output Capacitance (Time Related) –––
Typ.
–––
120
35
46
26
120
51
63
5150
460
250
570
700
Max. Units
Conditions
––– S VDS = 50V, ID = 75A
180 nC ID = 75A
–––
–––
g VDS = 60V
VGS = 10V
––– ns VDD = 48V
–––
ID = 75A
–––
–––
g RG = 3.9
VGS = 10V
––– pF VGS = 0V
–––
VDS = 50V
–––
ƒ = 1.0MHz
–––
–––
i VGS = 0V, VDS = 0V to 60V , See Fig.11
h VGS = 0V, VDS = 0V to 60V , See Fig. 5
Diode Characteristics
Symbol
Parameter
IS
Continuous Source Current
(Body Diode)
ISM
Pulsed Source Current
Ãd (Body Diode)
VSD
dv/dt
Diode Forward Voltage
Peak Diode Recovery
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
IRRM
Reverse Recovery Current
ton
Forward Turn-On Time
Min. Typ. Max. Units
Conditions
™ ––– ––– 130 A MOSFET symbol
D
showing the
––– ––– 510 A integral reverse
G
p-n junction diode.
S
–––
–––
–––
11
1.3
–––
g V TJ = 25°C, IS = 75A, VGS = 0V
f V/ns TJ = 175°C, IS = 75A, VDS = 75V
––– 38 57 ns TJ = 25°C
VR = 64V,
––– 46 69
TJ = 125°C
––– 65 98 nC TJ = 25°C
g IF = 75A
di/dt = 100A/μs
––– 86 130
TJ = 125°C
––– 2.8 ––– A TJ = 25°C
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
Notes:
 Calculated continuous current based on maximum allowable junction † Coss eff. (TR) is a fixed capacitance that gives the same charging time
temperature. Package limitation current is 75A.
‚ Repetitive rating; pulse width limited by max. junction
temperature.
ƒ Limited by TJmax, starting TJ = 25°C, L = 0.096mH
as Coss while VDS is rising from 0 to 80% VDSS.
‡ Coss eff. (ER) is a fixed capacitance that gives the same energy as
Coss while VDS is rising from 0 to 80% VDSS.
ˆ When mounted on 1" square PCB (FR-4 or G-10 Material). For recom mended
RG = 25, IAS = 75A, VGS =10V. Part not recommended for use
above this value.
„ ISD  75A, di/dt  530A/μs, VDD V(BR)DSS, TJ  175°C.
… Pulse width  400μs; duty cycle  2%.
footprint and soldering techniques refer to application note #AN-994.
‰ R is measured at TJ approximately 90°C.
Š RJC (end of life) for D2Pak and TO-262 = 0.75°C/W. Note: This is the
maximum measured value after 1000 temperature cycles from -55 to 150°C
and is accounted for by the physical wearout of the die attach medium.
2
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