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IRFS3307PBF Datasheet, PDF (2/11 Pages) International Rectifier – High Efficiency Synchronous Rectification in SMPS | |||
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IRFB/S/SL3307PbF
Static @ TJ = 25°C (unless otherwise specified)
Symbol
Parameter
V(BR)DSS
ïV(BR)DSS/ïTJ
RDS(on)
VGS(th)
IDSS
Drain-to-Source Breakdown Voltage
Breakdown Voltage Temp. Coefficient
Static Drain-to-Source On-Resistance
Gate Threshold Voltage
Drain-to-Source Leakage Current
IGSS
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
RG
Gate Input Resistance
Min. Typ. Max. Units
Conditions
75 âââ âââ
âââ 0.069 âââ
âââ 5.0 6.3
V VGS = 0V, ID = 250μA
d V/°C Reference to 25°C, ID = 1mA
g mï VGS = 10V, ID = 75A
2.0 âââ 4.0 V VDS = VGS, ID = 150μA
âââ âââ 20 μA VDS = 75V, VGS = 0V
âââ âââ 250
VDS = 75V, VGS = 0V, TJ = 125°C
âââ âââ 200 nA VGS = 20V
âââ âââ -200
VGS = -20V
âââ 1.5 âââ ï f = 1MHz, open drain
Dynamic @ TJ = 25°C (unless otherwise specified)
Symbol
Parameter
Min.
gfs
Forward Transconductance
98
Qg
Total Gate Charge
âââ
Qgs
Gate-to-Source Charge
âââ
Qgd
Gate-to-Drain ("Miller") Charge
âââ
td(on)
Turn-On Delay Time
âââ
tr
Rise Time
âââ
td(off)
Turn-Off Delay Time
âââ
tf
Fall Time
âââ
Ciss
Input Capacitance
âââ
Coss
Output Capacitance
âââ
Crss
Reverse Transfer Capacitance
âââ
h Coss eff. (ER) Effective Output Capacitance (Energy Related) âââ
Coss eff. (TR) Effective Output Capacitance (Time Related) âââ
Typ.
âââ
120
35
46
26
120
51
63
5150
460
250
570
700
Max. Units
Conditions
âââ S VDS = 50V, ID = 75A
180 nC ID = 75A
âââ
âââ
g VDS = 60V
VGS = 10V
âââ ns VDD = 48V
âââ
ID = 75A
âââ
âââ
g RG = 3.9ï
VGS = 10V
âââ pF VGS = 0V
âââ
VDS = 50V
âââ
Æ = 1.0MHz
âââ
âââ
i VGS = 0V, VDS = 0V to 60V , See Fig.11
h VGS = 0V, VDS = 0V to 60V , See Fig. 5
Diode Characteristics
Symbol
Parameter
IS
Continuous Source Current
(Body Diode)
ISM
Pulsed Source Current
Ãd (Body Diode)
VSD
dv/dt
Diode Forward Voltage
Peak Diode Recovery
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
IRRM
Reverse Recovery Current
ton
Forward Turn-On Time
Min. Typ. Max. Units
Conditions
 âââ âââ 130 A MOSFET symbol
D
showing the
âââ âââ 510 A integral reverse
G
p-n junction diode.
S
âââ
âââ
âââ
11
1.3
âââ
g V TJ = 25°C, IS = 75A, VGS = 0V
f V/ns TJ = 175°C, IS = 75A, VDS = 75V
âââ 38 57 ns TJ = 25°C
VR = 64V,
âââ 46 69
TJ = 125°C
âââ 65 98 nC TJ = 25°C
g IF = 75A
di/dt = 100A/μs
âââ 86 130
TJ = 125°C
âââ 2.8 âââ A TJ = 25°C
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
Notes:
 Calculated continuous current based on maximum allowable junction  Coss eff. (TR) is a fixed capacitance that gives the same charging time
temperature. Package limitation current is 75A.
 Repetitive rating; pulse width limited by max. junction
temperature.
 Limited by TJmax, starting TJ = 25°C, L = 0.096mH
as Coss while VDS is rising from 0 to 80% VDSS.
 Coss eff. (ER) is a fixed capacitance that gives the same energy as
Coss while VDS is rising from 0 to 80% VDSS.
 When mounted on 1" square PCB (FR-4 or G-10 Material). For recom mended
RG = 25ï, IAS = 75A, VGS =10V. Part not recommended for use
above this value.
 ISD ï£ 75A, di/dt ï£ 530A/μs, VDD ï£ï V(BR)DSS, TJ ï£ 175°C.
Â
Pulse width ï£ 400μs; duty cycle ï£ 2%.
footprint and soldering techniques refer to application note #AN-994.
 Rï± is measured at TJ approximately 90°C.
 Rï±JC (end of life) for D2Pak and TO-262 = 0.75°C/W. Note: This is the
maximum measured value after 1000 temperature cycles from -55 to 150°C
and is accounted for by the physical wearout of the die attach medium.
2
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