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IRF7413PBF Datasheet, PDF (2/9 Pages) International Rectifier – HEXFET Power MOSFET
IRF7413PbF
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
Symbol
Parameter
Min Typ Max Units
Conditions
V(BR)DSS
Drain-to-Source Breakdown Voltage
∆V(BR)DSS/∆TJ Breakdown Voltage Temp. Coefficient
RDS(on)
VGS(th)
gfs
Static Drain-to-Source On-Resistance
Gate Threshold Voltage
Forward Transconductance
30 ––– ––– V VGS = 0V, ID = 250µA
–––
–––
–––
0.034 –––
––– 0.011
––– 0.018
V/°C Reference to 25°C, ID = 1mA
f Ω VGS = 10V, ID = 7.3A
f VGS = 4.5V, ID = 3.7A
1.0 ––– 3.0 V VDS = VGS, ID = 250µA
10 ––– ––– S VDS = 10V, ID = 3.7A
IDSS
Drain-to-Source Leakage Current
––– ––– 1.0
––– ––– 25
µA VDS = 30V, VGS = 0V
VDS = 24V, VGS = 0V, TJ = 125°C
IGSS
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
––– ––– -100 nA VGS = -20V
––– ––– 100
VGS = 20V
Qg
Total Gate Charge
––– 52 79
ID = 7.3A
Qgs
Qgd
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
––– 6.1
––– 16
9.2
23
f nC VDS = 24V
VGS = 10V, See Fig. 6 and 9
RG
Gate Resistance
1.2 ––– 3.7
td(on)
Turn-On Delay Time
tr
Rise Time
td(off)
Turn-Off Delay Time
tf
Fall Time
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
––– 8.6 –––
––– 50 –––
––– 52 –––
––– 46 –––
––– 1800 –––
––– 680 –––
––– 240 –––
VDD = 15V
ID = 7.3A
f ns RG = 6.2 Ω
RG = 2.0Ω, See Fig. 10
VGS = 0V
pF VDS = 25V
ƒ = 1.0MHz, See Fig. 5
Source-Drain Ratings and Characteristics
Symbol
Parameter
IS
Continuous Source Current
(Body Diode)
ISM
Pulsed Source Current
Ù (Body Diode)
VSD
Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
Min. Typ. Max. Units
Conditions
––– ––– 3.1
MOSFET symbol
A showing the
––– ––– 58
––– ––– 1.0
––– 74 110
––– 200 300
integral reverse
e p-n junction diode.
V TJ = 25°C, IS = 7.3A, VGS = 0V
e ns TJ = 25°C, IF = 7.3A
nC di/dt = 100A/µs
Notes:
 Repetitive rating; pulse width limited by
max. junction temperature. ( See fig. 11 )
‚ Starting TJ = 25°C, L =9.8mH
RG = 25Ω, IAS =7.3A. (See Figure 12)
ƒ ISD ≤ 7.3A, di/dt ≤ 100A/µs, VDD ≤ V(BR)DSS,
TJ ≤ 150°C
„ Pulse width ≤ 300µs; duty cycle ≤ 2%.
… Surface mounted on FR-4 board
† Rθ is measured at TJ approximately 90°C