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AUIRLL014N Datasheet, PDF (2/12 Pages) International Rectifier – HEXFET® Power MOSFET | |||
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AUIRLL014N
Static Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
Parameter
Min. Typ. Max. Units
Conditions
V(BR)DSS
Drain-to-Source Breakdown Voltage
ïV(BR)DSS/ïTJ Breakdown Voltage Temp. Coefficient
RDS(on)
Static Drain-to-Source On-Resistance
VGS(th)
gfs
IDSS
Gate Threshold Voltage
Forward Transconductance
Drain-to-Source Leakage Current
IGSS
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
55 âââ âââ
âââ 0.015 âââ
âââ âââ 0.14
âââ âââ 0.20
âââ âââ 0.28
1.0 âââ 2.0
2.3 âââ âââ
âââ âââ 25
âââ âââ 250
âââ âââ 100
âââ âââ -100
V
V/°C
ï
V
S
μA
nA
VGS = 0V, ID = 250μA
Reference to 25°C, ID = 1mA
f VGS = 10V, ID = 2.0A
f VGS = 5.0V, ID = 1.2A
f VGS = 4.0V, ID = 1.0A
VDS = VGS, ID = 250μA
VDS = 25V, ID = 1.0A
VDS = 55V, VGS = 0V
VDS = 44V, VGS = 0V, TJ = 150°C
VGS = 16V
VGS = -16V
Dynamic Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
Parameter
Min. Typ. Max. Units
Conditions
Qg
Total Gate Charge
âââ 9.5 14
ID = 2.0A
Qgs
Qgd
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
âââ 1.1 1.7
âââ 3.0 4.4
f nC VDS = 44V
VGS = 10V, See Fig. 6 and 9
td(on)
Turn-On Delay Time
âââ 5.1 âââ
VDD = 28V
tr
Rise Time
âââ 4.9 âââ ns ID = 2.0A
td(off)
Turn-Off Delay Time
tf
Fall Time
âââ 14 âââ
âââ 2.9 âââ
f RG = 6.0 ï
RD = 14ïï¬ï See Fig. 10ï
Ciss
Input Capacitance
âââ 230 âââ
VGS = 0V
Coss
Output Capacitance
âââ 66 âââ pF VDS = 25V
Crss
Reverse Transfer Capacitance
âââ 30 âââ
Æ = 1.0MHz, See Fig. 5
Diode Characteristics
Parameter
Min. Typ. Max. Units
Conditions
IS
Continuous Source Current
âââ âââ 1.3
MOSFET symbol
(Body Diode)
ISM
Pulsed Source Current
ÃÂ (Body Diode)
VSD
Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
ton
Forward Turn-On Time
âââ âââ 16
A showing the
integral reverse
âââ âââ 1.0
âââ 41 61
âââ 73 110
f p-n junction diode.
V TJ = 25°C, IS = 2.0A, VGS = 0V
f ns TJ = 25°C, IF = 2.0A
nC di/dt = 100A/μs
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
Notes:
 Repetitive rating; pulse width limited by
max. junction temperature. ( See fig. 11)
 VDD = 25V, starting TJ = 25°C, L = 4.0mH
RG = 25ï, IAS = 4.0A. (See Figure 12)
 ISD ï£ 2.0A, di/dt ï£ 170A/µs, VDD ï£ V(BR)DSS,
TJ ï£ 150°C .
 Pulse width ï£ï 300µs; duty cycleï ï£ 2%.
Â
When mounted on FR-4 board using minimum recommended
footprint.
 When mounted on 1 inch square copper board, for comparison
with other SMD devices.
2
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