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AUIRLL014N Datasheet, PDF (2/12 Pages) International Rectifier – HEXFET® Power MOSFET
AUIRLL014N
Static Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
Parameter
Min. Typ. Max. Units
Conditions
V(BR)DSS
Drain-to-Source Breakdown Voltage
V(BR)DSS/TJ Breakdown Voltage Temp. Coefficient
RDS(on)
Static Drain-to-Source On-Resistance
VGS(th)
gfs
IDSS
Gate Threshold Voltage
Forward Transconductance
Drain-to-Source Leakage Current
IGSS
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
55 ––– –––
––– 0.015 –––
––– ––– 0.14
––– ––– 0.20
––– ––– 0.28
1.0 ––– 2.0
2.3 ––– –––
––– ––– 25
––– ––– 250
––– ––– 100
––– ––– -100
V
V/°C

V
S
μA
nA
VGS = 0V, ID = 250μA
Reference to 25°C, ID = 1mA
f VGS = 10V, ID = 2.0A
f VGS = 5.0V, ID = 1.2A
f VGS = 4.0V, ID = 1.0A
VDS = VGS, ID = 250μA
VDS = 25V, ID = 1.0A
VDS = 55V, VGS = 0V
VDS = 44V, VGS = 0V, TJ = 150°C
VGS = 16V
VGS = -16V
Dynamic Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
Parameter
Min. Typ. Max. Units
Conditions
Qg
Total Gate Charge
––– 9.5 14
ID = 2.0A
Qgs
Qgd
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
––– 1.1 1.7
––– 3.0 4.4
f nC VDS = 44V
VGS = 10V, See Fig. 6 and 9
td(on)
Turn-On Delay Time
––– 5.1 –––
VDD = 28V
tr
Rise Time
––– 4.9 ––– ns ID = 2.0A
td(off)
Turn-Off Delay Time
tf
Fall Time
––– 14 –––
––– 2.9 –––
f RG = 6.0 
RD = 14See Fig. 10
Ciss
Input Capacitance
––– 230 –––
VGS = 0V
Coss
Output Capacitance
––– 66 ––– pF VDS = 25V
Crss
Reverse Transfer Capacitance
––– 30 –––
ƒ = 1.0MHz, See Fig. 5
Diode Characteristics
Parameter
Min. Typ. Max. Units
Conditions
IS
Continuous Source Current
––– ––– 1.3
MOSFET symbol
(Body Diode)
ISM
Pulsed Source Current
Ù (Body Diode)
VSD
Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
ton
Forward Turn-On Time
––– ––– 16
A showing the
integral reverse
––– ––– 1.0
––– 41 61
––– 73 110
f p-n junction diode.
V TJ = 25°C, IS = 2.0A, VGS = 0V
f ns TJ = 25°C, IF = 2.0A
nC di/dt = 100A/μs
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
Notes:
 Repetitive rating; pulse width limited by
max. junction temperature. ( See fig. 11)
‚ VDD = 25V, starting TJ = 25°C, L = 4.0mH
RG = 25, IAS = 4.0A. (See Figure 12)
ƒ ISD  2.0A, di/dt  170A/µs, VDD  V(BR)DSS,
TJ  150°C .
„ Pulse width 300µs; duty cycle 2%.
… When mounted on FR-4 board using minimum recommended
footprint.
† When mounted on 1 inch square copper board, for comparison
with other SMD devices.
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