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IRFB3207 Datasheet, PDF (1/11 Pages) International Rectifier – HEXFET Power MOSFET
Applications
l High Efficiency Synchronous Rectification in SMPS
l Uninterruptible Power Supply
l High Speed Power Switching
l Hard Switched and High Frequency Circuits
Benefits
G
l Worldwide Best RDS(on) in TO-220
l Improved Gate, Avalanche and Dynamic dV/dt
Ruggedness
l Fully Characterized Capacitance and Avalanche
SOA
l Enhanced body diode dV/dt and dI/dt Capability
PD - 96893A
IRFB3207
IRFS3207
IRFSL3207
HEXFET® Power MOSFET
D VDSS
RDS(on) typ.
max.
S ID
75V
3.6m:
4.5m:
180A
G DS
TO-220AB
IRFB3207
G DS
D2Pak
IRFS3207
G DS
TO-262
IRFSL3207
Absolute Maximum Ratings
Symbol
Parameter
ID @ TC = 25°C
ID @ TC = 100°C
IDM
PD @TC = 25°C
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current d
Maximum Power Dissipation
Linear Derating Factor
VGS
dV/dt
Gate-to-Source Voltage
Peak Diode Recovery f
TJ
TSTG
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
(1.6mm from case)
Mounting torque, 6-32 or M3 screw
Avalanche Characteristics
EAS (Thermally limited) Single Pulse Avalanche Energy e
IAR
Avalanche Current c
EAR
Repetitive Avalanche Energy g
Thermal Resistance
Symbol
Parameter
RθJC
Junction-to-Case k
RθCS
Case-to-Sink, Flat Greased Surface , TO-220
RθJA
Junction-to-Ambient, TO-220 k
RθJA
Junction-to-Ambient (PCB Mount) , D2Pak jk
www.irf.com
Max.
180c
130c
720
330
2.2
± 20
5.8
-55 to + 175
300
10lbxin (1.1Nxm)
910
See Fig. 14, 15, 16a, 16b,
Typ.
–––
0.50
–––
–––
Max.
0.45
–––
62
40
Units
A
W
W/°C
V
V/ns
°C
mJ
A
mJ
Units
°C/W
1
11/3/04