IRF7534D1 Datasheet, PDF (1/8 Pages) International Rectifier – FETKY MOSFET & Schottky Diode(Vdss=-20V, Rds(on)=0.055ohm, Schottky Vf=0.39V)

PD -93864
IRF7534D1
q Co-packaged HEXFET^® power
MOSFET and Schottky diode
q Ultra Low On-Resistance
MOSFET
q Trench technology
q Micro8^TM Footprint
q Available in Tape & Reel
Description
FETKY MOSFET & Schottky Diode
A
1
A
2
8
K
7
K
V_DSS = -20V
S
3
6 _{D RDS(on) = 0.055Ω}
G
4
5
D
Schottky Vf=0.39V
Top View
The FETKY family of co-packaged MOSFETs and Schottky diodes offers the designer
an innovative, board space saving solution for switching regulator and power
management applications. International Rectifier utilizes advanced processing
techniques to achieve extremely low on-resistance per silicon area. Combining this
technology with International Rectifier’s low forward drop Schottky rectifiers results in
an extremely efficient device suitable for use in a wide variety of portable electronics
applications, such as cell phones, PDAs, etc.
The Micro8^TM package makes an ideal device for applications where printed circuit
board space is at a premium. The low profile (<1.1mm) of the Micro8^TM will allow it to
fit easily into extremely thin application environments such as portable electronics
Absolute Maximum Ratings
Parameter
V_DS
I_D @ T_A = 25°C
I_D @ T_A = 70°C
I_DM
P_D @T_A = 25°C
P_D @T_A = 70°C
Drain-Source Voltage
Continuous Drain Current, V_GS @ -4.5V
Continuous Drain Current, V_GS @ -4.5V
Pulsed Drain Current
Maximum Power Dissipation„
Maximum Power Dissipation„
Linear Derating Factor
V_GS
dv/dt
Gate-to-Source Voltage
Peak Diode Recovery dv/dt ‚
T_J , T_STG
Junction and Storage Temperature Range
Max.
-20
-4.3
-3.4
-34
1.25
0.8
10
± 12
1.1
-55 to + 150
Micro8™
Units
V
A
W
W
mW/°C
V
V/ns
°C
Thermal Resistance
Parameter
Max.
Units
R_θJA
Maximum Junction-to-Ambient „
100
Notes:
 Repetitive rating – pulse width limited by max. junction temperature (see Fig. 9)
‚ I_SD ≤ -1.2A, di/dt ≤ 100A/µs, V_DD ≤ V_(BR)DSS, T_J ≤ 150°C
ƒ Pulse width ≤ 300µs – duty cycle ≤ 2%
„ When mounted on 1 inch square copper board to approximate typical multi-layer PCB thermal resistance
°C/W
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