GB25XF120K Datasheet, PDF (1/11 Pages) International Rectifier – IGBT 6PACK MODULE

PD - 94569
GB25XF120K
IGBT 6PACK MODULE
Features
• Low VCE (on) Non Punch Through IGBT Technology
• Low Diode VF
• 10µs Short Circuit Capability
• Square RBSOA
• HEXFRED Antiparallel Diode with Ultrasoft Diode
Reverse Recovery Characteristics
• Positive VCE (on) Temperature Coefficient
• Ceramic DBC Substrate
• Low Stray Inductance Design
Benefits
• Benchmark Efficiency for Motor Control
• Rugged Transient Performance
• Low EMI, Requires Less Snubbing
• Direct Mounting to Heatsink
• PCB Solderable Terminals
• Low Junction to Case Thermal Resistance
• UL Listed 
ECONO2 6PACK
V_CES = 1200V
I_C = 25A, T_C=80°C
t_sc > 10µs, T_J=150°C
V_CE(on) typ. = 2.35V
Absolute Maximum Ratings
Parameter
V_CES
I_C @ T_C = 25°C
I_C @ T_C = 80°C
I_CM
I_LM
I_F @ T_C = 25°C
I_F @ T_C = 80°C
I_FM
V_GE
P_D @ T_C = 25°C
P_D @ T_C = 80°C
T_J
T_STG
V_ISOL
Collector-to-Emitter Voltage
Continuous Collector Current
Continuous Collector Current
Pulsed Collector Current (Ref.Fig.C.T.5)
Clamped Inductive Load current
Diode Continuous Forward Current
Diode Continuous Forward Current
Diode Maximum Forward Current
Gate-to-Emitter Voltage
Maximum Power Dissipation
Maximum Power Dissipation
Maximum Operating Junction Temperature
Storage Temperature Range
Isolation Voltage
Thermal and Mechanical Characteristics
Parameter
R_θJC (IGBT)
Junction-to-Case- IGBT
R_θJC (Diode)
Junction-to-Case- Diode
R_θCS (Module) Case-to-Sink, flat, greased surface
Mounting Torque (M5)
Weight
www.irf.com
Max.
1200
40
25
80
80
40
25
80
±20
198
111
150
-40 to +125
AC 2500 (1min)
Units
V
A
V
W
°C
V
Min.
–––
–––
–––
2.7
–––
Typ.
–––
–––
0.05
–––
170
Max.
0.63
1.00
–––
3.3
–––
Units
°C/W
N^.m
g
1
10/18/02