HCTS283MS Datasheet, PDF (9/9 Pages) Intersil Corporation – Radiation Hardened 4 Bit Binary Full Adder with Fast Carry

HCTS283MS
Die Characteristics
DIE DIMENSIONS:
78 x 86 mils
2.21mm x 2.19mm
METALLIZATION:
Type: SiAl
Metal Thickness: 11kÅ ± 1kÅ
GLASSIVATION:
Type: SiO₂
Thickness: 13kÅ ± 2.6kÅ
WORST CASE CURRENT DENSITY: <2.0 x 10⁵A/cm²
BOND PAD SIZE:
100µm x 100µm
4 x 4 mils
Metallization Mask Layout
HCTS283MS
S1
VCC
B2
(1)
(16)
(15)
B1 (2)
A1 (3)
S0 (4)
A2
(14)
(13) S2
(12) A3
A0 (5)
B0 (6)
(11) B3
(7)
(8)
CIN
GND
(9)
(10)
COUT
S3
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
Spec Number 518641
9