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| HCTS160MS Datasheet, PDF (9/9 Pages) Intersil Corporation – Radiation Hardened Synchronous Counter | |||
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Die Characteristics
DIE DIMENSIONS:
104 x 86 mils
METALLIZATION:
Type: AlSi
Metal Thickness: 11kÃ
± 1kÃ
GLASSIVATION:
Type: SiO2
Thickness: 13kÃ
± 2.6kÃ
WORST CASE CURRENT DENSITY:
<2.0 x 105A/cm2
BOND PAD SIZE:
100µm x 100µm
4 mils x 4 mils
Metallization Mask Layout
HCTS160MS
HCTS160MS
CD
MR VCC
(2)
(1)
(16)
P0 (3)
P1 (4)
P2 (5)
P3 (6)
PE (7)
(8)
(9)
(10)
GND SPE
TE
(15) TC
(14) Q0
(13) Q1
(12) Q2
(11) Q3
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCTS160 is TA14445A.
Spec Number 518611
568
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