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| HCTS147MS Datasheet, PDF (9/10 Pages) Intersil Corporation – Radiation Hardened 10-to-4 Line Priority Encoder | |||
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Die Characteristics
DIE DIMENSIONS:
85 x 101 mils
METALLIZATION:
Type: SiAl
Metal Thickness: 11kÃ
± 1kÃ
GLASSIVATION:
Type: SiO2
Thickness: 13kÃ
± 2.6kÃ
WORST CASE CURRENT DENSITY:
<2.0 x 105A/cm2
BOND PAD SIZE:
100µm x 100µm
4 mils x 4 mils
Metallization Mask Layout
I5
(2)
HCTS147MS
HCTS147MS
I4
VCC
NC
(1)
(16)
(15)
I6 (3)
I7 (4)
I8 (5)
Y2 (6)
(14) Y3
(13) I3
(12) I2
(11) I8
(7)
(8)
Y1
GND
(9)
(10)
Y0
I9
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCTS147 is TA14482A.
Spec Number 518608
538
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