HCS241MS Datasheet, PDF (9/9 Pages) Intersil Corporation – Radiation Hardened Inverting Octal Three-State Buffer/Line Driver

Die Characteristics
DIE DIMENSIONS:
108 x 106 mils
METALLIZATION:
Type: AlSi
Metal Thickness: 11kÅ ± 1kÅ
GLASSIVATION:
Type: SiO₂
Thickness:13kÅ ± 2.6kÅ
WORST CASE CURRENT DENSITY:
< 2.0 x 10⁵A/cm²
BOND PAD SIZE:
100µm x 100µm
4 mils x 4 mils
Metallization Mask Layout
HCS241MS
HCS241MS
AI2 (4)
BO3 (5)
AI3 (6)
BO2 (7)
310
(18) AO1
(17) BI4
(16) AO2
(15) BI3
(14) AO3
Spec Number 518838