HCTS75MS Datasheet, PDF (8/9 Pages) Intersil Corporation – Radiation Hardened Dual 2-Bit Bistable Transparent Latch

Die Characteristics
DIE DIMENSIONS:
89 x 88 mils
2.25 x 2.24mm
METALLIZATION:
Type: SiAl
Metal Thickness: 11kÅ ± 1kÅ
GLASSIVATION:
Type: SiO₂
Thickness: 13kÅ ± 2.6kÅ
WORST CASE CURRENT DENSITY:
<2.0 x 10⁵A/cm²
BOND PAD SIZE:
100µm x 100µm
4 x 4 mils
Metallization Mask Layout
D0 1
(2)
HCTS75MS
HCTS75MS
Q0 1
(1)
Q0 1
(16)
D1 1 (3)
E 2 (4)
VCC (5)
D0 2 (6)
(15) 1 Q1
(14) 1 Q1
(13) 1 E
(12) GND
D1 2 (7)
(11) 2 Q0
(8)
Q1 2
(9)
Q1 2
(10)
Q0 2
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCTS75 is TA14442A.
Spec Number 518625
477