HCS10MS Datasheet, PDF (8/8 Pages) Intersil Corporation – Radiation Hardened Triple 3-Input NAND Gate

Die Characteristics
DIE DIMENSIONS:
87 x 88 mils
2.20mm x 2.24mm
METALLIZATION:
Type: AlSi
Metal Thickness: 11kÅ ± 1kÅ
GLASSIVATION:
Type: SiO₂
Thickness: 13kÅ ± 2.6kÅ
WORST CASE CURRENT DENSITY:
<2.0 x 10⁵A/cm²
BOND PAD SIZE:
100µm x 100µm
4 x 4 mils
Metallization Mask Layout
HCS10MS
HCS10MS
A1
VCC
C1
(1)
(14)
(13)
B1 (2)
A2 (3)
B2 (4)
C2 (5)
(6)
(7)
(8)
Y2
GND
Y3
8
(12) Y1
(11) C3
(10) B3
(9) A3
Spec Number 518747