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CD4013BMS Datasheet, PDF (8/9 Pages) Intersil Corporation – CMOS Dual ‘D’-Type Flip-Flop
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CD4013BMS
Typical Performance Characteristics (Continued)
AMBIENT TEMPERATURE (TA) = +25oC
tr, tf = 5ns
CL = 50pF
30
25
20
15
10
5
0
5
10
15
20
SUPPLY VOLTAGE (VDD) (V)
FIGURE 8. TYPICAL MAXIMUM CLOCK FREQUENCY vs
SUPPLY VOLTAGE
104 8
6
4
2
103 8
SUPPLY VOLTAGE
(VDD) = 15V
6
10V
4
2
102
8
6
4
2
10 8
6
4
2
10V
5V
CL = 50pF
CL = 15pF
AMBIENT TEMPERATURE (TA) = +25oC
INPUT tr = tf = 20ns
1
2
102
4 6 8 2 4 68 2 4 68 2 4 68 2
103
104
105
106
INPUT FREQUENCY (ft) (HZ)
4 68
FIGURE 9. TYPICAL POWER DISSIPATION vs FREQUENCY
Chip Dimensions and Pad Layout
CONTACT YOUR LOCAL SALES OFFICE FOR
Dimension in parenthesis are in millimeters and are
derived from the basic inch dimensions as indicated.
Grid graduations are in mils (10-3 inch).
METALLIZATION: Thickness: 11kÅ − 14kÅ, AL.
PASSIVATION: 10.4kÅ - 15.6kÅ, Silane
BOND PADS: 0.004 inches X 0.004 inches MIN
DIE THICKNESS: 0.0198 inches - 0.0218 inches
7-69
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