CD4006BMS Datasheet, PDF (8/8 Pages) Intersil Corporation – CMOS 18-Stage Static Register

CD4006BMS
Typical Performance Characteristics (Continued)
8
6
AMBIENT TEMPERATURE (T_A) = +25^oC
4
2 ^{SUPPLY VOLTAGE (VDD) = 15V}
10⁴
8
6
4
10V
10V
5V
2
10³
8
6
4
2
10²
8
6
4
2
10
1
2 4 68
10
CL = 50pF
CL = 15pF
2 4 6 8 2 4 68 2 4 68 2 4 6
10²
10³
10⁴
INPUT FREQUENCY (fCL) (kHz)
FIGURE 7. TYPICAL DYANAMIC POWER DISSIPATION
AS A FUNCTION OF CLOCK FREQUENCY
Chip Dimensions and Pad Layout
Dimensions in parentheses are in millimeters
and are derived from the basic inch dimensions
as indicated. Grid graduations are in mils (10^-3 inch)
METALLIZATION: Thickness: 11kÅ − 14kÅ, AL.
PASSIVATION: 10.4kÅ - 15.6kÅ, Silane
BOND PADS: 0.004 inches X 0.004 inches MIN
DIE THICKNESS: 0.0198 inches - 0.0218 inches
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