HCS245MS Datasheet, PDF (7/7 Pages) Intersil Corporation – Radiation Hardened Octal Bus Transceiver, Three-State, Non-Inverting

HCS245MS
Die Characteristics
DIE DIMENSIONS:
124 x 110 mils
METALLIZATION:
Type: AlSi
Metal Thickness: 11kÅ ± 1kÅ
GLASSIVATION:
Type: SiO₂
Thickness: 13kÅ ± -2.6kÅ
DIE ATTACH:
Material: Silver Epoxy
WORST CASE CURRENT DENSITY:
<2.0 x 10⁵A/cm²
BOND PAD SIZE:
100µm x 100µm
4 mils x 4 mils
Metallization Mask Layout
HCS245MS
DIR VCC
OE
NC
NC
(1)
(20) _NC
NC
(19)
A0 (2)
A1 (3)
A2 (4)
A3 (5)
A4 (6)
(18) B0
(17) B1
(16) B2
(15) B3
(14) B4
A5 (7)
(8)
(9)
(10)
(11)
(12)
A6
A7
GND
B7
B6
7-481
(13) B5