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CD4041BMS Datasheet, PDF (7/7 Pages) Intersil Corporation – CMOS Quad True/Complement Buffer
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CD4041UBMS
Typical Performance Characteristics (Continued)
8
6
AMBIENT TEMPERATURE (TA) = +25oC
4
105
2
8
6
4 100kHz AT 15V
1kHz AT 15V
104
2
8
6
4
103
2
8
6
4
10kHz AT 15V
100kHz AT 5V
102
2
8
6
4
10kHz AT 5V
10
2
8
6
4
1kHz AT 5V
2
2
10
4 68 2
102
4 68 2
103
4 68 2
104
4 68 2 4 68 2 4 68
105
106
107
INPUT RISE AND FALL TIME (tr, tf) (ns)
FIGURE 10. TYPICAL POWER DISSIPATION vs INPUT RISE
AND FALL TIME PER OUTPUT PAIR
4
2
105
8
6
4
2
104
AMBIENT TEMPERATURE (TA) = +25oC
INPUT tr = tp = 20ns
VDD = 15V
10V
8
6
5V
4
2
5V
103 8
6
3V
4
2
102 8
6
4
2
101
8
6
4
2
2
103
CL = 15pF
CL = 50pF
4 68 2 4 68 2 4 68 2 4 68
104
105
106
107
FREQUENCY (f) (Hz)
FIGURE 11. TYPICAL POWER DISSIPATION vs FREQUENCY
PER OUTPUT PAIR
Chip Dimensions and Pad Layout
8
7
6
9
10
11
12
13
14
1
Dimensions in parentheses are in millimeters
and are derived from the basic inch dimensions
as indicated. Grid graduations are in mils (10-3 inch)
5
METALLIZATION: Thickness: 11kÅ − 14kÅ, AL.
4 PASSIVATION: 10.4kÅ - 15.6kÅ, Silane
BOND PADS: 0.004 inches X 0.004 inches MIN
DIE THICKNESS: 0.0198 inches - 0.0218 inches
DIE SIZE: X = 72 (69 - 77)
3
Y = 82 (79 - 87)
2
7