English
Language : 

82C82 Datasheet, PDF (7/7 Pages) Intersil Corporation – CMOS Octal Latching Bus Driver
Die Characteristics
DIE DIMENSIONS:
118.1 x 92.1 x 19 ±1mils
METALLIZATION:
Type: Si - Al
Thickness: 11kÅ ±1kÅ
Metallization Mask Layout
D11
2
D12
3
D13
4
D14
5
82C82
GLASSIVATION:
Type: SiO2
Thickness: 8kÅ ±1kÅ
WORST CASE CURRENT DENSITY:
2.00 x 105 A/cm2
82C82
D10
VCC DO0
D01
1
20
19
18
17
DO2
16
DO3
15
DO4
D15
6
D16
7
8
9
10
11
12
D17 OE GND
STB DO7
14
DO5
13
DO6
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate
and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
4-280