ISL71091SEH40 Datasheet, PDF (6/16 Pages) Intersil Corporation – 4.096V Radiation Hardened Ultra Low Noise,

ISL71091SEH40
Electrical Specifications for Die V_IN = 8V, I_OUT = 0, C_L = 1µF and C_COMP = 0.001µF unless otherwise specified. Boldface limits apply
after radiation at +25°C and across the operating temperature range, -55°C to +125°C without radiation, unless otherwise specified. Specifications
over temperature are guaranteed but not production tested on die.
PARAMETER
DESCRIPTION
CONDITIONS
MIN
MAX
(Note 6)
TYP
(Note 6) UNITS
V_OUT
V_OA
Output Voltage
V_OUT Accuracy at T_A = +25°C
V_OUT = 4.096V (Note 10)
V_OUT Accuracy at T_A = -55°C to +125°C V_OUT = 4.096V (Note 10)
V_OUT Accuracy at T_A = +25°C, Post
Radiation
V_OUT = 4.096V (Note 10)
4.096
V
-0.05
+0.05
%
-0.15
+0.15
%
-0.25
+0.25
%
TC V_OUT
Output Voltage Temperature
Coefficient (Note 7)
6
ppm/°C
V_IN
Input Voltage Range
V_OUT = 4.096V
6.0
30.0
V
I_IN
Supply Current
0.3
0.5
mA
V_OUT /V_IN Line Regulation
V_IN = 6.0V to 30V
0.3
5.0
ppm/V
V_OUT/I_OUT Load Regulation
Sourcing: 0mA ≤ I_OUT ≤ 10mA
11
20
ppm/mA
Sinking: -5mA ≤ I_OUT ≤ 0mA
25
50
ppm/mA
V_D
Dropout Voltage (Note 8)
I_OUT = 10mA
1.1
1.6
V
NOTES:
6. Compliance to datasheet limits is assured by one or more methods: production test, characterization and/or design.
7. Across the specified temperature range. Temperature coefficient is measured by the box method whereby the change in V_OUT is divided by the
temperature range; in this case, -55°C to +125°C = +180°C.
8. Dropout Voltage is the minimum V_IN - V_OUT differential voltage measured at the point where V_OUT drops 1mV from V_IN = nominal at T_A = +25°C.
9. Post-reflow drift for the ISL71091SEH40 devices can exceed 100µV based on experimental results with devices on FR4 double-sided boards. The
engineer must take this into account when considering the reference voltage after assembly.
10. The V_OUT accuracy is based on die mount with Silver Glass die attach material such as “QMI 2569” or equivalent in a package with an Alumina
ceramic substrate.
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6
FN8634.2
March 17, 2016