HCTS540MS Datasheet, PDF (6/10 Pages) Intersil Corporation – Radiation Hardened Inverting Octal Buffer/Line Driver, Three-State

Specifications HCTS540MS
TABLE 7. TOTAL DOSE IRRADIATION
CONFORMANCE
GROUPS
METHOD
TEST
PRE RAD
POST RAD
Group E Subgroup 2
5005
1, 7, 9
Table 4
NOTE:
1. Except FN test which will be performed 100% Go/No-Go.
READ AND RECORD
PRE RAD
POST RAD
1, 9
Table 4 (Note 1)
TABLE 8. STATIC BURN-IN AND DYNAMIC BURN-IN TEST CONNECTIONS
OSCILLATOR
OPEN
GROUND
1/2 VCC = 3V ± 0.5V
VCC = 6V ± 0.5V
50kHz
25kHz
STATIC BURN-IN I TEST CONNECTIONS (Note 1)
11 - 18
1 - 10, 19
-
20
-
-
STATIC BURN-IN II TEST CONNECTIONS (Note 1)
11 - 18
10
-
1 - 9, 19, 20
-
-
DYNAMIC BURN-IN TEST CONNECTIONS (Note 2)
-
10
11 - 18
20
1, 19
2-9
NOTES:
1. Each pin except VCC and GND will have a resistor of 10KΩ ± 5% for static burn-in.
2. Each pin except VCC and GND will have a resistor of 680Ω ± 5% for dynamic burn-in.
TABLE 9. IRRADIATION TEST CONNECTIONS
OPEN
GROUND
VCC = 5V ± 0.5V
11 - 18
10
1 - 9, 19, 20
NOTE: Each pin except VCC and GND will have a resistor of 47KΩ ± 5% for irradiation testing.
Group E, Subgroup 2, sample size is 4 dice/wafer 0 failures.
Spec Number 518631
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