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| HCTS540MS Datasheet, PDF (10/10 Pages) Intersil Corporation – Radiation Hardened Inverting Octal Buffer/Line Driver, Three-State | |||
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Die Characteristics
DIE DIMENSIONS:
101 x 85mils
METALLIZATION:
Type: SiAl
Metal Thickness: 11kÃ
± 1kÃ
GLASSIVATION:
Type: SiO2
Thickness: 13kÃ
± 2.6kÃ
WORST CASE CURRENT DENSITY:
<2.0 x 105A/cm2
BOND PAD SIZE:
100µm x 100µm
4 mils x 4 mils
Metallization Mask Layout
A0
(2)
HCTS540MS
HCTS540MS
OE1
(1)
VCC
(20)
OE2
(19)
A1 (3)
A2 (4)
A3 (5)
A4 (6)
A5 (7)
A6 (8)
(18) Y0
(17) Y1
(16) Y2
(15) Y3
(14) Y4
(13) Y5
(9)
(10)
(11)
(12)
A7
GND
Y7
Y6
NOTE: The die diagram is a generic plot form a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCTS540 is TA14455A.
Spec Number 518631
10
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