ISL55110_15 Datasheet, PDF (4/18 Pages) Intersil Corporation – Dual, High Speed MOSFET Driver

ISL55110, ISL55111
Absolute Maximum Ratings (T_A = +25°C)
V_H to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14.0V
V_DD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.5V
VIN-A, VIN-B, PD, ENABLE . . . . . . . . . . . . . . . . (GND - 0.5V) to (V_DD + 0.5V)
OA, OB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . (GND - 0.5) to (VH + 0.5V)
Maximum Peak Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300mA
ESD Rating
Human Body Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3kV
Thermal Information
Thermal Resistance
_JA (°C/W) _JC (°C/W)
16 Ld (4x4) QFN Package (Notes 5, 6) . . .
45
3.0
8 Ld TSSOP Package (Notes 4, 7) . . . . . . . 140
46
Maximum Junction Temperature (Plastic Package) . . . . . . . . . . . +150°C
Maximum Storage Temperature Range. . . . . . . . . . . . . . . . . -65°C to +150°C
Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see TB493
Recommended Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C
Drive Supply Voltage (V_H) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5V to 13.2V
Logic Supply Voltage (V_DD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.7V to 5.5V
Ambient Temperature (T_A) . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C
Junction Temperature (T_J) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +150°C
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product
reliability and result in failures not covered by warranty.
NOTES:
4. _JA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
5. _JA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech
Brief TB379.
6. For _JC, the “case temp” location is the center of the exposed metal pad on the package underside.
7. For _JC, the “case temp” location is taken at the package top center.
IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typical values are for information purposes only. Unless otherwise
noted, all tests are at the specified temperature and are pulsed tests, therefore: T_J = T_C = T_A
DC Electrical Specifications V_H = +12V, V_DD = 2.7V to 5.5V, T_A = +25°C, unless otherwise specified.
PARAMETER
DESCRIPTION
TEST CONDITIONS
MIN
(Note 8)
TYP
LOGIC CHARACTERISTICS
VIX_LH
VIX_HL
VHYS
Logic Input Threshold - Low-to-High
Logic Input Threshold - High-to-Low
Logic Input Hysteresis
l_IH = 1µA: VIN-A, VIN-B
l_IL = 1µA: VIN-A, VIN-B
VIN-A, VIN-B
1.32
1.12
1.42
1.22
0.2
VIH
Logic Input High Threshold
PD
2.0
VIL
Logic Input Low Threshold
PD
0
VIH
Logic Input High Threshold
ENABLE - QFN only
2.0
VIL
Logic Input Low Threshold
ENABLE - QFN only
0
IIX_H
Input Current Logic High
VIN-A, VIN-B = VDD
10
IIX_L
Input Current Logic Low
VIN-A, VIN-B = 0V
10
II_H
Input Current Logic High
PD = VDD
10
II_L
Input Current Logic Low
PD = 0V
10
II_H
Input Current Logic High
ENABLE = VDD (QFN only)
II_L
Input Current Logic Low
ENABLE = 0V (QFN only)
-25
DRIVER CHARACTERISTICS
r_DS
Driver Output Resistance
OA, OB
3
I_DC
Driver Output DC Current (>2s)
100
I_AC
Peak Output Current
Design Intent; verified via
3.5
simulation.
VOH to VOL Driver Output Swing Range
OA or OB = “1”, voltage
3
referenced to GND
MAX
(Note 8)
1.52
1.32
VDD
0.8
VDD
0.8
20
20
20
15
12
6
13.2
UNITS
V
V
V
V
V
V
V
nA
nA
nA
nA
µA
nA
Ω
mA
A
V
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4
FN6228.8
January 29, 2015