5962F-9568901VXC Datasheet, PDF (4/4 Pages) Intersil Corporation – Radiation Hardened Quad Differential Line Receiver

HS-26C32RH, HS-26C32EH
Die Characteristics
DIE DIMENSIONS:
78 mils x 123 mils
(1970µm x 3120µm)
INTERFACE MATERIALS:
Glassivation:
Type: SiO₂
Thickness: 10kÅ ± 1kÅ
Top Metallization:
M1: Mo/Tiw
Thickness: 5800Å
M2: Al/Si/Cu
Thickness: 5800Å
Worst Case Current Density:
<2.0 x 10⁵A/cm²
Bond Pad Size:
110µm x 100µm
Metallization Mask Layout
HS-26C32RH, HS-26C32EH
AIN
V_DD
BIN
(1)
(16)
(15)
AIN (2)
(14) B_IN
A_OUT (3)
ENAB (4)
C_OUT (5)
C_IN (6)
(13) B_OUT
(12) ENAB
(11) D_OUT
(10) D_IN
(7)
(8)
(9)
CIN
GND
DIN
4
FN3402.5
May 28, 2013