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ISL6237 Datasheet, PDF (33/35 Pages) Intersil Corporation – High-Efficiency, Quad-Output, Main Power Supply Controllers for Notebook Computers
ISL6237
current limit and cause the fault latch to trip. To protect
against this possibility, "overdesign" the circuit to tolerate:
ILOAD = ILIMIT(HIGH) + ((LIR) ⁄ 2) ⋅ ILOAD(MAX)
(EQ. 21)
where ILIMIT(HIGH) is the maximum valley current allowed
by the current-limit circuit, including threshold tolerance and
resistance variation.
Rectifier Selection
Current circulates from ground to the junction of both
MOSFETs and the inductor when the high-side switch is off.
As a consequence, the polarity of the switching node is
negative with respect to ground. This voltage is
approximately -0.7V (a diode drop) at both transition edges
while both switches are off (dead time). The drop is
IL ⋅ rDS(ON) when the low-side switch conducts.
The rectifier is a clamp across the synchronous rectifier that
catches the negative inductor swing during the dead time
between turning the high-side MOSFET off and the
synchronous rectifier on. The MOSFETs incorporate a
high-speed silicon body diode as an adequate clamp diode if
efficiency is not of primary importance. Place a Schottky diode
in parallel with the body diode to reduce the forward voltage
drop and prevent the Q2/Q4 MOSFET body diodes from
turning on during the dead time. Typically, the external diode
improves the efficiency by 1% to 2%. Use a Schottky diode
with a DC current rating equal to one-third of the load current.
For example, use an MBR0530 (500mA-rated) type for loads
up to 1.5A, a 1N5817 type for loads up to 3A, or a 1N5821
type for loads up to 10A. The rectifier's rated reverse
breakdown voltage must be at least equal to the maximum
input voltage, preferably with a 20% derating factor.
Applications Information
Dropout Performance
The output voltage-adjust range for continuous-conduction
operation is restricted by the nonadjustable 350ns (max)
minimum off-time one-shot. Use the slower 5V SMPS for the
higher of the two output voltages for best dropout
performance in adjustable feedback mode. The duty-factor
limit must be calculated using worst-case values for on- and
off-times, when working with low input voltages.
Manufacturing tolerances and internal propagation delays
introduce an error to the TON K-factor. Also, keep in mind that
transient-response performance of buck regulators operated
close to dropout is poor, and bulk output capacitance must
often be added (see Equation 10 on page 31).
The absolute point of dropout occurs when the inductor
current ramps down during the minimum off-time (ΔIDOWN) as
much as it ramps up during the on-time (ΔIUP). The ratio
h = ΔIUP/ΔIDOWN indicates the ability to slew the inductor
current higher in response to increased load, and must always
be greater than 1. As h approaches 1, the absolute minimum
dropout point, the inductor current is less able to increase
during each switching cycle and VSAG greatly increases
unless additional output capacitance is used.
A reasonable minimum value for h is 1.5, but this can be
adjusted up or down to allow trade-offs between VSAG,
output capacitance and minimum operating voltage. For a
given value of h, the minimum operating voltage can be
calculated as shown in Equation 22:
VIN(MIN)
=
(---V----O-----U----T---_-----+-----V----D----R----O-----P----)
1
–
⎛
⎝
t--O-----F----F---(--M-K----I--N----)---⋅---h--⎠⎞
+
VDROP2
–
VDROP1
(EQ. 22)
where VDROP1 and VDROP2 are the parasitic voltage drops
in the discharge and charge paths (see “On-Time One-Shot
(tON)” on page 19), tOFF(MIN) is from Electrical
Specifications on page 3 and K is taken from Table 2. The
absolute minimum input voltage is calculated with h = 1.
Operating frequency must be reduced or h must be increased
and output capacitance added to obtain an acceptable VSAG
if calculated VIN(MIN) is greater than the required minimum
input voltage. Calculate VSAG to be sure of adequate
transient response if operation near dropout is anticipated.
Dropout Design Example:
ISL6237: With VOUT2 = 5V, fsw = 400kHz, K = 2.25µs,
tOFF(MIN) = 350ns, VDROP1 = VDROP2 = 100mV, and
h = 1.5, the minimum VIN is:
VIN(MIN)
=
--------(---5---V------+-----0---.--1----V----)-------- + 0.1V – 0.1V=
1
–
⎛
⎝
0----.--3-2--5-.--2-μ--5--s--μ--⋅--s-1---.--5--⎠⎞
6.65 V
(EQ. 23)
Calculating with h = 1 yields:
VIN(MIN)
=
------(--5----V-----+-----0----.-1----V----)------ + 0.1V – 0.1V=
1
–
⎛
⎝
0----.2--3--.-52----μ5----sμ----s⋅---1--⎠⎞
6.04 V
(EQ. 24)
Therefore, VIN must be greater than 6.65V. A practical input
voltage with reasonable output capacitance would be 7.5V.
PC Board Layout Guidelines
Careful PC board layout is critical to achieve minimal switching
losses and clean, stable operation. This is especially true when
multiple converters are on the same PC board where one
circuit can affect the other. Refer to the ISL6237 Evaluation Kit
data sheet for a specific layout example.
Mount all of the power components on the top side of the board
with their ground terminals flush against one another, if
possible. Follow these guidelines for good PC board layout:
• Isolate the power components on the top side from the
sensitive analog components on the bottom side with a
ground shield. Use a separate PGND plane under the
OUT1 and OUT2 sides (called PGND1 and PGND2). Avoid
the introduction of AC currents into the PGND1 and PGND2
ground planes. Run the power plane ground currents on the
top side only, if possible.
33
FN6418.4
March 18, 2008