80C86 Datasheet, PDF (30/37 Pages) Intersil Corporation – CMOS 16-Bit Microprocessor

80C86
Metallization Topology
DIE DIMENSIONS:
249.2 x 290.9 x 19
METALLIZATION:
Type: Silicon - Aluminum
Thickness: 11kÅ ±2kÅ
Metallization Mask Layout
GLASSIVATION:
Type: Nitrox
Thickness: 10kÅ ±2kÅ
WORST CASE CURRENT DENSITY:
1.5 x 10⁵ A/cm²
80C86
AD11 AD12 AD13 AD14 GND
V_CC AD15 A16/S3 A17/S4 A18/S5
AD10
AD9
AD8
AD7
A19/S6
BHE/S7
MN/MX
RD
AD6
AD5
AD4
AD3
AD2
AD1
AD0
NMI INTR CLK
RQ/GT0
RQ/GT1
LOCK
S2
S1
S0
GND
RESET READY TEST QS1 QS0
30
FN2957.3
January 9, 2009