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ISL6296_08 Datasheet, PDF (3/19 Pages) Intersil Corporation – FlexiHash™ For Battery Authentication
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ISL6296
Absolute Maximum Ratings (Reference to GND)
Supply Voltage (VDD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5V
All Other Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.5 to VDD+0.5V
ESD Rating
Human Body Model (Per MIL-STD-883 Method 3015.7) . . .4000V
Machine Model (Per EIAJ ED-4701 Method C-111) . . . . . . . .400V
CDM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1000V
Recommended Operating Conditions
Ambient Temperature Range . . . . . . . . . . . . . . . . . . .-25°C to +85°C
Thermal Information
Thermal Resistance (Typical)
θJA (°C/W) θJC (°C/W)
SOT-23 Package (Note 2) . . . . . . . . . . 200
N/A
2x3 TDFN Package (Notes 3, 4) . . . . .
70
10.5
Maximum Junction Temperature (Plastic Package) . . . . . . . +125°C
Maximum Storage Temperature Range . . . . . . . . . .-40°C to +125°C
Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTES:
2. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
3. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
Tech Brief TB379.
4. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside.
5. Parts are 100% tested at +25°C. Temperature limits established by characterization and are not production tested.
Electrical Specifications Unless otherwise noted, all parameters are guaranteed over the operational supply voltage and temperature
range of the device as follows: TA = -25°C to +85°C; VDD = 2.6V to 4.8V.
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
MAX
(Note 5) TYP (Note 5) UNITS
DC CHARACTERISTICS
Supply Voltage
VDD During normal operation
During OTP ROM programming
2.6
-
4.8
V
2.8
-
4.8
V
Run Mode Supply Current
(exclude I/O current)
IDD VDD = 4.2V
VDD = 4.8V
Sleep Mode Supply Current
IDDS VDD = 4.2V, XSD pin floating
OTP Programming Mode Supply Current IDDP For ~ 1.8ms duration per write operation
Internal Regulated Supply Voltage
VRG Observable only in test mode
Internal OTP ROM Programming Voltage VPP Observable only in test mode
POR Release Threshold
VPOR+
POR Assertion Threshold
VPOR-
XSD PIN CHARACTERISTICS
-
110
140
µA
-
120
160
µA
-
0.15
0.5
µA
-
250
500
µA
2.3
2.5
2.7
V
11
12
13
V
1.9
2.2
2.4
V
1.5
1.8
2.1
V
XSD Input Low Voltage
VIL
XSD Input High Voltage
VIH
-0.4
-
0.5
V
1.5
-
VDD+
V
0.4V
XSD Input Hysteresis
VHYS
XSD Internal Pull-Down Current
IPD VDD = 2.6V
VDD = 4.2V
VDD = 4.8V
XSD Output Low Voltage
VOL IOL = 1mA
XSD Input Transition Time
tX 10% to 90% transition time
XSD Output Fall Time
tF 90% to 10%, CLOAD = 12pF
XSD Pin Capacitance
CPIN
XSD BUS TIMING CHARACTERISTICS (Refer to XSD Bus Symbol Timing Definitions Tables)
-
400
-
mV
-
0.8
-
µA
-
1.2
2.0
µA
-
1.8
2.5
µA
-
-
0.4
V
-
-
2
µs
-
-
50
ns
-
6
-
pF
Programming Bit Rate
x = 0.5 to 4
2.89
-
23.12
kHz
3
FN9201.2
March 21, 2008
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