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IRFP340 Datasheet, PDF (3/7 Pages) Intersil Corporation – 11A, 400V, 0.550 Ohm, N-Channel Power MOSFET | |||
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IRFP340
Source to Drain Diode Speciï¬cations
PARAMETER
Continuous Source to Drain Current
Pulse Source to Drain Current
(Note 3)
SYMBOL
TEST CONDITIONS
ISD
ISDM
Modified MOSFET
Symbol Showing the
Integral Reverse
D
P-N Junction Diode
G
MIN TYP
-
-
-
-
MAX
11
44
UNITS
A
A
S
Source to Drain Diode Voltage (Note 2)
Reverse Recovery Time
Reverse Recovered Charge
VSD
trr
QRR
TJ = 25oC, ISD = 11A, VGS = 0V (Figure 13)
TJ = 25oC, ISD = 10A, dISD/dt = 100A/µs
TJ = 25oC, ISD = 10A, dISD/dt = 100A/µs
-
-
2.0
V
170 370
790
ns
1.6 3.8
8.2
µC
NOTES:
2. Pulse test: pulse width ⤠300µs, duty cycle ⤠2%.
3. Repetitive rating: pulse width limited by Max junction temperature. See Transient Thermal Impedance curve (Figure 3).
4. VDD = 50V, starting TJ = 25oC, L = 7.0mH, RG = 50â¦, peak IAS = 11A.
Typical Performance Curves Unless Otherwise Speciï¬ed
1.2
1.0
0.8
0.6
0.4
0.2
0
0
50
100
150
TC , CASE TEMPERATURE (oC)
FIGURE 1. NORMALIZED POWER DISSIPATION vs CASE
TEMPERATURE
15
12
9
6
3
0
25
50
75
100
125
150
TC, CASE TEMPERATURE (oC)
FIGURE 2. MAXIMUM CONTINUOUS DRAIN CURRENT vs
CASE TEMPERATURE
1
0.5
0.2
0.1
0.1
0.05
0.02
10-2 0.01
SINGLE PULSE
10-3
10-5
10-4
10-3
10-2
0.1
t1, RECTANGULAR PULSE DURATION (s)
PDM
t1
t2t2
NOTES:
DUTY FACTOR: D = t1/t2
TJ = PDM x ZθJC x RθJC + TC
1
10
FIGURE 3. NORMALIZED MAXIMUM TRANSIENT THERMAL IMPEDANCE
4-331
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