ISL32601EFBZ Datasheet, PDF (21/23 Pages) Intersil Corporation – 1.8V to 3.3V, Micro-Power, ±15kV ESD, +125°C, Slew Rate Limited, RS-485/RS-422 Transceivers

ISL32600E, ISL32601E, ISL32602E, ISL32603E
Package Outline Drawing
M8.15
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
Rev 4, 1/12
INDEX
AREA
1
2
3
TOP VIEW
6.20 (0.244)
5.80 (0.228)
4.00 (0.157)
3.80 (0.150)
DETAIL "A"
1.27 (0.050)
0.40 (0.016)
0.50 (0.20)
0.25 (0.01) ^{x 45°}
8°
0°
0.25 (0.010)
0.19 (0.008)
SIDE VIEW “B”
5.00 (0.197)
4.80 (0.189)
1.27 (0.050)
0.51(0.020)
0.33(0.013)
SIDE VIEW “A
21
2.20 (0.087)
SEATING PLANE
1.75 (0.069)
1.35 (0.053)
-C-
0.25(0.010)
0.10(0.004)
1
8
0.60 (0.023)
2
7
1.27 (0.050)
3
6
4
5
5.20(0.205)
TYPICAL RECOMMENDED LAND PATTERN
NOTES:
1. Dimensioning and tolerancing per ANSI Y14.5M-1994.
2. Package length does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
3. Package width does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
4. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
5. Terminal numbers are shown for reference only.
6. The lead width as measured 0.36mm (0.014 inch) or greater above the
seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch).
7. Controlling dimension: MILLIMETER. Converted inch dimensions are not
necessarily exact.
8. This outline conforms to JEDEC publication MS-012-AA ISSUE C.
FN7967.0
June 22, 2012