ISL23328 Datasheet, PDF (20/20 Pages) Intersil Corporation – Dual, 128-Tap, Low Voltage Digitally Controlled Potentiometer (XDCP™)

ISL23328
Ultra Thin Quad Flat No-Lead Plastic Package (UTQFN)
D
6
INDEX AREA _N
2X 0.10 C
12
2X 0.10 C
TOP VIEW
AB
E
0.10 C
C
0.05 C
A
SEATING PLANE
A1
SIDE VIEW
e
PIN #1 ID
12
L1
K
NX L
(DATUM B)
(DATUM A)
NX b 5
16X
0.10 M C A B
0.05 M C
BOTTOM VIEW
NX (b)
(A1)
5
SECTION "C-C"
CL
e
CC
L
TERMINAL TIP
L16.2.6x1.8A
16 LEAD ULTRA THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE
MILLIMETERS
SYMBOL
MIN NOMINAL MAX
NOTES
A
0.45
0.50
0.55
-
A1
-
-
0.05
-
A3
0.127 REF
-
b
0.15
0.20
0.25
5
D
2.55
2.60
2.65
-
E
1.75
1.80
1.85
-
e
0.40 BSC
-
K
0.15
-
-
-
L
0.35
0.40
0.45
-
L1
0.45
0.50
0.55
-
N
16
2
Nd
4
3
Ne
4
3
θ
0
-
12
4
NOTES:
Rev. 5 2/09
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
2. N is the number of terminals.
3. Nd and Ne refer to the number of terminals on D and E side,
respectively.
4. All dimensions are in millimeters. Angles are in degrees.
5. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
7. Maximum package warpage is 0.05mm.
8. Maximum allowable burrs is 0.076mm in all directions.
9. JEDEC Reference MO-255.
10. For additional information, to assist with the PCB Land Pattern
Design effort, see Intersil Technical Brief TB389.
3.00
1.80
1.40
1.40
2.20
0.90
0.40
0.20
0.20
0.50
0.40
10 _{LAND PATTERN}
20
FN7902.0
August 19, 2011