X9258_13 Datasheet, PDF (2/19 Pages) Intersil Corporation – Low Noise/Low Power/2-Wire Bus/256 Taps

X9258
Ordering Information
PART NUMBER
(Note 2)
PART
MARKING
POTENTIOMETER TEMPERATURE
V_CC LIMITS ORGANIZATION
(V)
(kΩ)
RANGE
(°C)
PACKAGE
(Pb-free)
PKG.
DWG. #
X9258US24Z (Note 1) X9258US Z
5 ±10
50
0 to +70 24 Ld SOIC (300 mil)
M24.3
X9258US24IZ (Note 1) X9258US ZI
-40 to +85 24 Ld SOIC (300 mil)
M24.3
X9258UV24IZ
X9258UV ZI
-40 to +85 24 Ld TSSOP (4.4mm)
MDP0044
X9258TS24Z
X9258TS Z
100
0 to +70 24 Ld SOIC (300 mil)
M24.3
X9258TS24IZ (Note 1) X9258TS ZI
-40 to +85 24 Ld SOIC (300 mil)
M24.3
X9258US24Z-2.7 (Note 1) X9258US ZF 2.7 to 5.5
50
0 to +70 24 Ld SOIC (300 mil)
M24.3
X9258US24IZ-2.7 (Note 1) X9258US ZG
-40 to +85 24 Ld SOIC (300 mil)
M24.3
X9258UV24IZ-2.7
X9258UV ZG
-40 to +85 24 Ld TSSOP (4.4mm)
MDP0044
X9258TS24Z-2.7 (Note 1) X9258TS ZF
100
0 to +70 24 Ld SOIC (300 mil)
M24.3
X9258TS24IZ-2.7 (Note 1) X9258TS ZG
-40 to +85 24 Ld SOIC (300 mil)
M24.3
X9258TV24IZ-2.7
X9258TV ZG
-40 to +85 24 Ld TSSOP (4.4mm)
MDP0044
X9258TV24Z-2.7
X9258TV ZF
0 to +70 24 Ld TSSOP (4.4mm)
MDP0044
NOTES:
1. Add “T*” suffix for tape and reel. Please refer to TB347 for details on reel specifications.
2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte
tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil
Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
3. For Moisture Sensitivity Level (MSL), please see device information page for X9258. For more information on MSL please see tech brief TB363.
2
FN8168.6
December 15, 2011