ISL55033_15 Datasheet, PDF (2/13 Pages) Intersil Corporation – 400MHz Slew Rate Enhanced, Rail-to-Rail Output Gain Block

ISL55033
Pin Descriptions
PIN NUMBER
1
2
3
4
5
6
7
8
9
10
11
12
EP
PIN NAME
IN+_1
IN+_2
IN+_3
GND_IN-(1, 2, 3)
GND_PWR
GND_OUTPUT
OUTPUT_3
OUTPUT_2
OUTPUT_1
V+_OUTPUT
EN
V+
EP
EQUIVALENT
CIRCUIT
DESCRIPTION
Circuit 1
Amplifier 1 noninverting input
Circuit 1
Amplifier 2 noninverting input
Circuit 1
Amplifier 3 noninverting input
Circuit 4
Common input for amplifiers 1, 2, 3 inverting inputs
Circuits 1, 2, 4, 5 Power supply ground. This is also the potential of the exposed metal pad on the package
bottom.
Circuit 3
Output power supply ground
Circuit 3
Amplifier 3 output
Circuit 3
Amplifier 2 output
Circuit 3
Amplifier 1 output
Circuit 3
Output power supply
Circuit 2
Enable pin with internal pull-down: Logic “1” selects the disabled state; Logic “0” selects the
enabled state
Circuits 1, 2, 4 Positive power supply
Circuit 5
Package’s exposed thermal pad. Connect to GND_PWR.
V+
IN+
dV/dt
CLAMP
GND_PWR
CIRCUIT 1
V+
EN
GND_PWR
CIRCUIT 2
V+_OUTPUT
OUTPUT (1, 2, 3)
GND_OUTPUT
CIRCUIT 3
V+
GND_IN-(1, 2, 3)
500
DIE SUBSTRATE
GND_PWR
~1MΩ
GND_PWR
CIRCUIT 4
500k
THERMAL HEAT SINK PAD (EP)
CIRCUIT 5
Ordering Information
PART NUMBER
(Note 1, 2, 3)
PART
MARKING
TEMP RANGE
(°C)
PACKAGE
(RoHS Compliant)
PKG.
DWG. #
ISL55033IRTZ
5033
-40 to +85
12 Ld TQFN
L12.3x3A
NOTES:
1. Add “-T*” suffix for tape and reel. Please refer to TB347 for details on reel specifications.
2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte
tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil
Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
3. For Moisture Sensitivity Level (MSL), please see product information page for ISL55033. For more information on MSL, please see tech brief TB363.
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FN6346.1
June 29, 2015