ISL55033_15 Datasheet, PDF (12/13 Pages) Intersil Corporation – 400MHz Slew Rate Enhanced, Rail-to-Rail Output Gain Block

ISL55033
The QFN Package Requires Additional PCB
Layout Rules for the Thermal Pad
The thermal pad (EP) is electrically connected to power supply
ground (GND_PWR) through the high resistance IC substrate. Its
primary function is to provide heat sinking for the IC. However,
because of the connection to the power ground pins through the
substrate, the thermal pad must be tied to the power supply
ground to prevent unwanted current flow through the thermal
pad. Maximum AC performance is achieved if the thermal pad
has good contact to the IC ground pins. Heat sinking
requirements can be satisfied using thermal vias directly
beneath the thermal pad to a heat dissipating layer of a square
at least 1” on a side. Fill the PCB pad under the EP with vias and
connect those vias to a substantial ground plane. Reference
TB379, section 3) on page 2 and Appendix A, or JEDEC JESD51-5,
for more information.
l
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to web to make sure you
have the latest revision.
DATE
REVISION
CHANGE
June 29, 2015
FN6346.1
-Pin Descriptions table on page 2, updated equivalent circuit as follows:
Pin number 4: from Circuit 1 to Circuit 4.
Pin number 5: from Circuit 4 to Circuits 1, 2, 4, 5 and added sentence to the description.
Pin number 6: from Circuit 4 to Circuit 3.
Pin number 10: from Circuit 4 to Circuit 3.
Pin number 12: from Circuit 4 to Circuits 1, 2, 4.
Added EP details to the table.
Updated Circuits 3 and 4 figure.
-Ordering information table on page 2: Removed ISL55033EVAL1Z.
- Ordering information table on page 2: Added MSL note.
-Thermal Information table on page 3, added “Theta jc” and reference “Note 5”.
-“Electrical Specification” table on page 3, test condition from V+ = 5V to V+_VOUT = 5V.
-Electrical Specification” table on page 3, under enable section changed “Parameter” name “VIH-ENB” to
“VIL-ENB” for the 0.8V typical value and changed “Parameter” name “VIL-ENB” to “VIH-ENB” for the 2V
typical value.
-“PC Board Layout” on page 11, changed reference from “0.01µF” cap to “0.1µF”, removed paragraph
referencing “NIC” pins.
-updated “The QFN Package Requires Additional PCB Layout Rules for the Thermal Pad” on page 12
paragraph.
- Added revision history and about Intersil verbiage.
About Intersil
Intersil Corporation is a leading provider of innovative power management and precision analog solutions. The company's products
address some of the largest markets within the industrial and infrastructure, mobile computing and high-end consumer markets.
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Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time
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FN6346.1
June 29, 2015