English
Language : 

IRF9240 Datasheet, PDF (2/7 Pages) Seme LAB – P-CHANNEL POWER MOSFET
IRF9240
Absolute Maximum Ratings TC = 25oC, Unless Otherwise Specified
Drain to Source Breakdown Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDS
Drain to Gate Voltage (RGS = 20kΩ) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDGR
Continuous Drain
TC = 100oC . .
Current
.......
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.ID
.ID
Pulsed Drain Current (Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IDM
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VGS
Maximum Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PD
Linear Derating Factor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Single Pulse Avalanche Energy Rating (Note 4). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . EAS
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TJ, TSTG
aximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TL
Package Body for 10s, See Techbrief 334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Tpkg
IRF9240
-200
-200
-11
-7
-44
±20
125
1
790
-55 to 150
300
260
UNITS
V
V
A
A
A
V
W
W/oC
mJ
oC
oC
oC
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. TJ = 25oC to TJ = 125oC.
Electrical Specifications TC = 25oC, Unless Otherwise Specified
PARAMETER
SYMBOL
TEST CONDITIONS
Drain to Source Breakdown Voltage
Gate Threshold Voltage
Zero Gate Voltage Drain Current
On-State Drain Current (Note 2)
BVDSS
VGS(TH)
IDSS
ID(ON)
ID = -250µA, VGS = 0V, (Figure10)
VGS = VDS, ID = -250µA
VDS = Rated BVDSS, VGS = 0V
VDS = 0.8 x Rated BVDSS, VGS = 0V, TC = 125oC
VDS > ID(ON) x rDS(ON)MAX, VGS = -10V,
(Figure 7)
Gate to Source Leakage Current
On Resistance (Note 2)
Forward Transconductance (Note 2)
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
IGSS
rDS(ON)
gfs
td(ON)
tr
td(OFF)
tf
VGS = ±20V
ID = -6A, VGS = -10V, (Figures 8, 9)
VDS > ID(ON) x rDS(ON)MAX, ID = -6A, (Figure 12)
VDD = 1.00 x Rated BVDSS, ID ≈ 11A,
RG = 9.1Ω, VGS = 10V, (Figure 17, 18)
RL = 17.5Ω for BVDSS = 150V
RL = 9.6Ω for BVDSS = 200V
MOSFET Switching Times are Essentially
Independent of Operating Temperature
Total Gate Charge
(Gate to Source + Gate to Drain)
Gate to Source Charge
Gate to Drain “Miller” Charge
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Internal Drain Inductance
Qg(TOT)
Qgs
Qgd
CISS
COSS
CRSS
LD
VGS = -10V, ID = -11A, VDS = 0.8 x Rated BVDSS,
(Figures 14, 19, 20))
Gate Charge is Essentially Independent of
Operating Temperature
VDS = -25V, VGS = 0V, f = 1MHz, (Figure 11)
Measured Between the
Contact Screw on the
Flange that is Closer to
Source and Gate Pins and
the Center of Die
Modified MOSFET
Symbol Showing the In-
ternal Devices
Inductances
D
Internal Source Inductance
LS
Measured From the Source
Lead, 6mm (0.25in) From
LD
the Flange and the Source
Bonding Pad
G
LS
MIN
-200
-2
-
-
-11
-
-
4
-
-
-
-
-
-
-
-
-
-
-
-
Thermal Resistance Junction to Case
Thermal Resistance Junction to
Ambient
RθJC
RθJA
Typical Socket Mount
S
-
-
TYP MAX UNITS
-
-
V
-
-4
V
-
-25
µA
-
-250
µA
-
-
A
- ±100 nA
0.35 0.500 Ω
6
-
S
18
22
ns
45
68
ns
75
90
ns
29
44
ns
70
90
nC
55
-
nC
15
-
nC
1100 -
pF
375
-
pF
150
-
pF
5.0
-
nH
12.5
-
nH
-
1
oC/W
-
62.5 oC/W
5-27