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IRF630 Datasheet, PDF (2/7 Pages) NXP Semiconductors – N-channel TrenchMOS transistor
IRF630, RF1S630SM
Absolute Maximum Ratings TC = 25oC, Unless Otherwise Specified
Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDS
Drain to Gate Voltage (RGS = 20kΩ) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDGR
Continuous Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .ID
TC = 100oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .ID
Pulsed Drain Current (Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IDM
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VGS
Maximum Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PD
Linear Derating Factor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Single Pulse Avalanche Energy Rating (Note 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . EAS
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TJ, TSTG
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TL
Package Body for 10s, See Techbrief 334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Tpkg
IRF630, RF1S630SM
200
200
9
6
36
±20
75
0.6
150
-55 to 150
300
260
UNITS
V
V
A
A
A
V
W
W/oC
mJ
oC
oC
oC
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. TJ = 25oC to 125oC.
Electrical Specifications TC = 25oC, Unless Otherwise Specified
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
Drain to Source Breakdown Voltage
Gate Threshold Voltage
Zero Gate Voltage Drain Current
On-State Drain Current (Note 2)
Gate to Source Leakage Current
Drain to Source On Resistance (Note 2)
Forward Transconductance (Note 2)
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Total Gate Charge
(Gate to Source + Gate to Drain)
Gate to Source Charge
Gate to Drain “Miller” Charge
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Internal Drain Inductance
Internal Source Inductance
BVDSS ID = 250µA, VGS = 0V (Figure 10)
200
VGS(TH) VGS = VDS, ID = 250µA
2
IDSS VDS = Rated BVDSS, VGS = 0V
-
VDS = 0.8 x Rated BVDSS, VGS = 0V, TJ = 125oC
-
ID(ON) VDS > ID(ON) x rDS(ON)MAX, VGS = 10V
9
IGSS VGS = ±20V
-
rDS(ON) ID = 5A, VGS = 10V (Figure 8, 9)
-
gfs
VDS > ID(ON) x rDS(ON)MAX, ID = 5A (Figure 12)
3
td(ON) VDD = 90V, ID ≈ 9A, RGS = 9.1Ω, VGS = 10V
-
tr
RL = 9.6Ω
MOSFET Switching Times are Essentially
-
td(OFF) Independent of Operating Temperature
-
tf
-
Qg(TOT) VGS = 10V, ID = 9A, VDS = 0.8 x Rated BVDSS
-
Ig(REF) = 1.5mA (Figure 14)
Qgs
Gate Charge is Essentially Independent of
Operating Temperature
-
Qgd
-
CISS VDS = 25V, VGS = 0V, f = 1MHz (Figure 11)
-
COSS
-
CRSS
-
LD
Measured From the
Modified MOSFET
-
Contact Screw on Tab to Symbol Showing the
Center of Die
Internal Devices
Measured From the Drain Inductances
-
Lead, 6mm (0.25in) From
D
Package to Center of Die
LD
LS
Measured From the
-
Source Lead, 6mm
G
(0.25in) From Header to
LS
Source Bonding Pad
S
Thermal Resistance Junction to Case
RθJC
-
Thermal Resistance Junction to Ambient
RθJA Free Air Operation
-
TYP
-
-
-
-
-
-
0.25
4.8
-
-
-
-
19
10
9
600
250
80
3.5
4.5
7.5
-
-
MAX
-
4
25
250
-
±100
0.4
-
30
50
50
40
30
UNITS
V
V
µA
µA
A
nA
Ω
S
ns
ns
ns
ns
nC
-
nC
-
nC
-
pF
-
pF
-
pF
-
nH
-
nH
-
nH
1.67 oC/W
80
oC/W
4-203