HCS02MS Datasheet, PDF (2/8 Pages) Intersil Corporation – Radiation Hardened Quad 2-Input NOR Gate

Specifications HCS02MS
Absolute Maximum Ratings
Reliability Information
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +7.0V
Input Voltage Range, All Inputs . . . . . . . . . . . . .-0.5V to VCC +0.5V
DC Input Current, Any One Input . . . . . . . . . . . . . . . . . . . . . . . .±10mA
DC Drain Current, Any One Output. . . . . . . . . . . . . . . . . . . . . . .±25mA
(All Voltage Reference to the VSS Terminal)
Storage Temperature Range (TSTG) . . . . . . . . . . . -65^oC to +150^oC
Junction Temperature (TJ) . . . . . . . . . . . . . . . . . . . . . . . . . . +175^oC
Lead Temperature (Soldering 10sec) . . . . . . . . . . . . . . . . . . +265^oC
ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 1
Thermal Resistance
θ_JA
SBDIP Package. . . . . . . . . . . . . . . . . . . . 74^oC/W
Ceramic Flatpack Package . . . . . . . . . . . 116^oC/W
Maximum Package Power Dissipation at +125^oC
θ_JC
24^oC/W
30^oC/W
SBDIP Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.66W
Ceramic Flatpack Package . . . . . . . . . . . . . . . . . . . . . . . . . 0.43W
If device power exceeds package dissipation capability, provide heat
sinking or derate linearly at the following rate:
SBDIP Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13.5mW/^oC
Ceramic Flatpack Package . . . . . . . . . . . . . . . . . . . . . . 8.6mW/^oC
CAUTION: As with all semiconductors, stress listed under “Absolute Maximum Ratings” may be applied to devices (one at a time) without resulting in permanent
damage. This is a stress rating only. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. The conditions listed
under “Electrical Performance Characteristics” are the only conditions recommended for satisfactory device operation..
Operating Conditions
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +4.5V to +5.5V
Input Rise and Fall Times at 4.5V VCC (TR, TF) . . . . . 100ns/V Max
Operating Temperature Range (T_A) . . . . . . . . . . . . -55^oC to +125^oC
Input Low Voltage (VIL). . . . . . . . . . . . . . .0.0V to 30% of VCC Max.
Input High Voltage (VIH) . . . . . . . . . . . . . . 70% of VCC to VCC Min.
TABLE 1. DC ELECTRICAL PERFORMANCE CHARACTERISTICS
PARAMETERS
Quiescent Current
SYMBOL
(NOTE 1)
CONDITIONS
ICC
VCC = 5.5V,
VIN = VCC or GND
Output Current
(Sink)
IOL
VCC = 4.5V, VIH = 4.5V,
VOUT = 0.4V, VIL = 0V
Output Current
(Source)
Output Voltage Low
Output Voltage High
Input Leakage
Current
IOH
VOL
VOH
IIN
VCC = 4.5V, VIH = 4.5V,
VOUT = VCC -0.4V,
VIL = 0V
VCC = 4.5V, VIH = 3.15V,
IOL = 50µA, VIL = 1.35V
VCC = 5.5V, VIH = 3.85V,
IOL = 50µA, VIL = 1.65V
VCC = 4.5V, VIH = 3.15V,
IOH = -50µA, VIL = 1.35V
VCC = 5.5V, VIH = 3.85V,
IOH = -50µA, VIL = 1.65V
VCC = 5.5V, VIN = VCC or
GND
Noise Immunity
Functional Test
FN
VCC = 4.5V,
VIH = 0.70(VCC),
VIL = 0.30(VCC) (Note 2)
GROUP
A SUB-
GROUPS
1
2, 3
1
2, 3
1
2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1
2, 3
7, 8A, 8B
TEMPERATURE
+25^oC
+125^oC, -55^oC
+25^oC
+125^oC, -55^oC
+25^oC
+125^oC, -55^oC
+25^oC, +125^oC, -55^oC
+25^oC, +125^oC, -55^oC
+25^oC, +125^oC, -55^oC
+25^oC, +125^oC, -55^oC
+25^oC
+125^oC, -55^oC
+25^oC, +125^oC, -55^oC
LIMITS
MIN MAX UNITS
-
10
µA
-
200
µA
4.8
-
mA
4.0
-
mA
-4.8
-
mA
-4.0
-
mA
-
0.1
V
-
0.1
V
VCC
-
V
-0.1
VCC
-
V
-0.1
-
±0.5
µA
-
±5.0
µA
-
-
-
NOTES:
1. All voltages reference to device GND.
2. For functional tests, VO ≥ 4.0V is recognized as a logic “1”, and VO ≤ 0.5V is recognized as a logic “0”.
Spec Number 518744
2