HD6409_15 Datasheet, PDF (15/15 Pages) Intersil Corporation – CMOS Manchester Encoder-Decoder

HD-6409
Package Outline Drawing
M20.3
20 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE (SOIC)
Rev 3, 2/11
20
INDEX
AREA
7.60
7.40
3
10.65
10.00
0.25 (0.10) M B M
1 23
TOP VIEW
2
13.00
12.60
2.65
2.35
SEATING PLANE
1.27
BSC
7
0.49
0.35
0.25 (0.10) M C A M B S
SIDE VIEW
0.30
MAX
0.10 (0.004)
8°
MAX
5 ^1.27
0.40
0.75 _{x 45°}
0.25
DETAIL "X"
0.32
0.23
(0.60)
20
(9.40mm)
1.27 BSC
(2.00)
12 3
TYPICAL RECOMMENDED LAND PATTERN
NOTES:
1. Dimensioning and tolerancing per ASME Y14.5M-1994.
2. Dimension does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
3. Dimension does not include interlead lash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
4. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
5. Dimension is the length of terminal for soldering to a substrate.
6. Terminal numbers are shown for reference only.
7. The lead width as measured 0.36mm (0.14 inch) or greater above
the seating plane, shall not exceed a maximum value of 0.61mm
(0.024 inch)
8. Controlling dimension: MILLIMETER.
9. Dimensions in ( ) for reference only.
10. JEDEC reference drawing number: MS-013-AC.
15
FN2951.4
October 1, 2015