ISL59446 Datasheet, PDF (13/13 Pages) Intersil Corporation – 500MHz Triple 4:1 Gain-of-2, Multiplexing Amplifier

ISL59446
Quad Flat No-Lead Plastic Package (QFN)
Micro Lead Frame Plastic Package (MLFP)
A
D
B
1
2
PIN #1
3
I.D. MARK
E
2X
0.075 C
TOP VIEW
2X
0.075 C
b
L
0.10 M C A B
PIN #1 I.D.
3
1
2
3
(E2)
NE ⁵
7
(D2)
BOTTOM VIEW
L32.5x6A (One of 10 Packages in MDP0046)
32 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
(COMPLIANT TO JEDEC MO-220)
MILLIMETERS
SYMBOL
MIN
NOMINAL MAX
NOTES
A
0.80
0.90
1.00
-
A1
0.00
0.02
0.05
-
D
5.00 BSC
-
D2
2.48 REF
-
E
6.00 BSC
-
E2
3.40 REF
-
L
0.45
0.50
0.55
-
b
0.17
0.22
0.27
-
c
0.20 REF
-
e
0.50 BSC
-
N
32 REF
4
ND
7 REF
6
NE
9 REF
5
NOTES:
Rev 1 2/09
1. Dimensioning and tolerancing per ASME Y14.5M-1994.
2. Tiebar view shown is a non-functional feature.
3. Bottom-side pin #1 I.D. is a diepad chamfer as shown.
4. N is the total number of terminals on the device.
5. NE is the number of terminals on the “E” side of the package
(or Y-direction).
6. ND is the number of terminals on the “D” side of the package
(or X-direction). ND = (N/2)-NE.
7. Inward end of terminal may be square or circular in shape with
radius (b/2) as shown.
e
C
SEATING
PLANE
0.10 C
0.08 C
SEE DETAIL "X"
N LEADS
& EXPOSED PAD
SIDE VIEW
(c)
A
C
A1
DETAIL X
2
(L)
N LEADS
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Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
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13
FN6261.1
August 26, 2010