ISL59420_14 Datasheet, PDF (13/13 Pages) Intersil Corporation – 400MHz Multiplexing Amplifier

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Package Outline Drawing
M10.118A (JEDEC MO-187-BA)
10 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE (MSOP)
Rev 0, 9/09
A
3.0 ± 0.1
10
0.25 C A B
1.10 Max
SIDE VIEW 2
DETAIL "X"
0.18 ± 0.05
PIN# 1 ID
B
12
0.5 BSC
TOP VIEW
H
0.23 +0.07/ -0.08
0.08 C A B
0.86 ± 0.09
C
SEATING PLANE
0.10 ± 0.05
0.10 C
SIDE VIEW 1
0.95 BSC
0.55 ± 0.15
DETAIL "X"
Gauge
Plane
0.25
3°±3°
5.80
4.40
3.00
0.50
0.30
1.40
TYPICAL RECOMMENDED LAND PATTERN
NOTES:
1. Dimensions are in millimeters.
2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
3. Plastic or metal protrusions of 0.15mm max per side are not
included.
4. Plastic interlead protrusions of 0.25mm max per side are not
included.
5. Dimensions “D” and “E1” are measured at Datum Plane “H”.
6. This replaces existing drawing # MDP0043 MSOP10L.
13
FN7459.2
July 3, 2012