CD4051BMS Datasheet, PDF (12/12 Pages) Intersil Corporation – CMOS Analog Multiplexers/Demultiplexers

CD4051BMS, CD4052BMS, CD4053BMS
Chip Dimensions and Pad Layouts
CD4051BMSH
CD4052BMSH
CD4053BMSH
Dimensions in parentheses are in millimeters and are
derived from the basic inch dimensions as indicated.
Grid graduations are in mils (10^-3 inch)
METALLIZATION: Thickness: 11kÅ − 14kÅ, AL.
PASSIVATION: 10.4kÅ - 15.6kÅ, Silane
BOND PADS: 0.004 inches X 0.004 inches MIN
DIE THICKNESS: 0.0198 inches - 0.0218 inches
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