HCTS646MS Datasheet, PDF (10/11 Pages) Intersil Corporation – Radiation Hardened Octal Bus Transceiver/Register, Three-State

Die Characteristics
DIE DIMENSIONS:
124 x 110 mils
METALLIZATION:
Type: SiAl
Metal Thickness: 11kÅ ± 1kÅ
GLASSIVATION:
Type: SiO₂
Thickness: 13kÅ ± 2.6kÅ
WORST CASE CURRENT DENSITY:
<2.0 x 10⁵A/cm²
BOND PAD SIZE:
100µm x 100µm
4 mils x 4 mils
Metallization Mask Layout
HCTS646MS
HCTS646MS
DIR SAB CAB VCC CBA SBA OE
(3)
(2)
(1) (24) (23) (22) (21)
A0 (4)
A1 (5)
A2 (6)
A3 (7)
A4 (8)
(20) B0
(19) B1
(18) B2
(17) B3
(16) B4
A5 (9)
(10)
(11)
(12)
(13)
(14)
A6
A7
GND
B7
B6
(15) B5
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCTS646 is TA14420A.
Spec Number 518628
715