HC5509A1R3060 Datasheet, PDF (10/10 Pages) Intersil Corporation – SLIC Subscriber Line Interface Circuit

HC5509A1R3060
Plastic Leaded Chip Carrier Packages (PLCC)
0.042 (1.07)
0.048 (1.22)
PIN (1) IDENTIFIER
CL
0.042 (1.07)
0.056 (1.42)
0.050 (1.27) TP
0.004 (0.10) C
0.025 (0.64)
0.045 (1.14)
R
N28.45 (JEDEC MS-018AB ISSUE A)
28 LEAD PLASTIC LEADED CHIP CARRIER PACKAGE
INCHES
MILLIMETERS
SYMBOL MIN
MAX
MIN
MAX NOTES
A
0.165
0.180
4.20
4.57
-
CL
E1 E
D2/E2
D2/E2
VIEW “A”
A1
0.090
0.120
2.29
3.04
-
D
0.485
0.495 12.32
12.57
-
D1
0.450
0.456 11.43
11.58
3
D2
0.191
0.219
4.86
5.56
4, 5
E
0.485
0.495 12.32
12.57
-
E1
0.450
0.456 11.43
11.58
3
0.020 (0.51) MAX
3 PLCS
D1
D
0.026 (0.66)
0.032 (0.81)
0.020 (0.51)
E2
MIN
N
A1
A
-C-
SEATING
PLANE
0.013 (0.33)
0.021 (0.53)
0.191
0.219
28
4.86
5.56
4, 5
28
6
Rev. 1 3/95
NOTES:
0.045 (1.14)
MIN
0.025 (0.64)
MIN
VIEW “A” TYP.
1. Controlling dimension: INCH. Converted millimeter dimensions
are not necessarily exact.
2. Dimensions and tolerancing per ANSI Y14.5M-1982.
3. Dimensions D1 and E1 do not include mold protrusions. Allow-
able mold protrusion is 0.010 inch (0.25mm) per side.
4. To be measured at seating plane -C- contact point.
5. Centerline to be determined where center leads exit plastic body.
6. “N” is the number of terminal positions.
10