CD4089BMS Datasheet, PDF (10/10 Pages) Intersil Corporation – CMOS Binary Rate Multiplier

CD4089BMS
Typical Performance Characteristics (Continued)
200 _{AMBIENT TEMPERATURE (TA) = +25oC}
AMBIENT TEMPERATURE (T_A) = +25^oC
150
SUPPLY VOLTAGE (VDD) = 15V
200
100
10V
SUPPLY VOLTAGE (VDD) = 5V
150
5V
100
10V
50
15V
50
0
20
40
60
80
100
LOAD CAPACITANCE (CL) (pF)
0
0
20
40
60
80
100
LOAD CAPACITANCE (CL) (pF)
FIGURE 9. TYP. PROPAGATION DELAY TIMES AS FUNCTION OF FIGURE 10. TYPICAL TRANSITION TIME AS A FUNCTION OF
LOAD CAPACITANCE (CLOCK OR STROBE TO OUT)
LOAD CAPACITANCE
10⁵ ₈
6
4
2
AMBIENT TEMPERATURE (T_A) = +25^oC
SUPPLY VOLTAGE (VDD) = 15V
10⁴ ₈
6
4
2
10³ ₈
6
4
2
10V
10V
5V
10² ₈
6
4
CL = 50pF
2
10
1
CL = 15pF
2 4 68 2 4 68 2 4 68 2 4 68 2 4 68
10
10²
10³
10⁴
INPUT FREQUENCY (fIN) (kHz)
FIGURE 11. TYPICAL DYNAMIC POWER DISSIPATION AS A FUNCTION OF INPUT FREQUENCY
Chip Dimensions and Pad Layout
Dimensions in parenthesis are in millimeters and are
derived from the basic inch dimensions as indicated.
Grid graduations are in mils (10^-3 inch).
METALLIZATION: Thickness: 11kÅ − 14kÅ, AL.
PASSIVATION: 10.4kÅ - 15.6kÅ, Silane
BOND PADS: 0.004 inches X 0.004 inches MIN
DIE THICKNESS: 0.0198 inches - 0.0218 inches
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