RD28F3208C3T70 Datasheet, PDF (67/70 Pages) Intel Corporation – 3 VOLT INTEL Advanced+ Boot Block Flash Memory (C3) Stacked-Chip ScalPackage Familye

3 Volt Intel^® Advanced+ Boot Block Flash Memory Stacked-CSP Family
F.2
Media Information
Figure 22. Stacked-CSP Device in Tray Orientation (8 mm x 10 mm and 8 mm x 12 mm
Device Pin 1
Tray Chamfer
NOTE: Drawing is not to scale and is only designed to show orientation of devices.
Figure 23. Stacked-CSP Device in 24 mm Tape (8 mm x 10 mm and 8 mm x 12 mm)
Device Pin 1
Datasheet
67