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RD28F3208C3T70 Datasheet, PDF (1/70 Pages) Intel Corporation – 3 VOLT INTEL Advanced+BootBlock FlashMemory(C3)Stacked-ChipScalPackageFamilye | |||
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3 Volt Intel® Advanced+ Boot Block
Flash Memory (C3) Stacked-Chip Scale
Package Family
Product Features
Datasheet
â Flash Memory Plus SRAM
â Reduces Memory Board Space
Required, Simplifying PCB Design
Complexity
â Stacked-Chip Scale Package (Stacked-
CSP) Technology
â Smallest Memory Subsystem Footprint
â Area : 8 x 10 mm for 16Mbit (0.13 µm)
Flash + 2Mbit or 4Mbit SRAM
â Area : 8 x 12 mm for 32Mbit (0.13 µm)
Flash + 4Mbit or 8Mbit SRAM
â Height : 1.20 mm for 16Mbit (0.13 µm)
Flash + 2Mbit or 4Mbit SRAM and
32Mbit (0.13um) Flash + 8Mbit SRAM
â Height : 1.40 mm for 32Mbit (0.13 µm)
Flash + 4Mbit SRAM
â This Family also includes 0.25 µm and
0.18 µm technologies
â Advanced SRAM Technology
â 70 ns Access Time
â Low Power Operation
â Low Voltage Data Retention Mode
â Intel® Flash Data Integrator (FDI)
Software
â Real-Time Data Storage and Code
Execution in the Same Memory Device
â Full Flash File Manager Capability
â Advanced+ Boot Block Flash Memory
â 70 ns Access Time at 2.7 V
â Instant, Individual Block Locking
â 128 bit Protection Register
â 12 V Production Programming
â Ultra Fast Program and Erase Suspend
â Extended Temperature â25 °C to +85 °C
â Blocking Architecture
â Block Sizes for Code + Data Storage
â 4-Kword Parameter Blocks (for data)
â 64-Kbyte Main Blocks (for code)
â 100,000 Erase Cycles per Block
â Low Power Operation
â Async Read Current: 9 mA (Flash)
â Standby Current: 7 µA (Flash)
â Automatic Power Saving Mode
â Flash Technologies
â 0.25 µm ETOX⢠VI, 0.18 µm ETOXâ¢
VII and 0.13 µm ETOX⢠VIII Flash
Technologies
â 28F160xC3, 28F320xC3
The 3 Volt Intel® Advanced+ Boot Block Flash Memory (C3) Stacked-Chip Scale Package
(Stacked-CSP) device delivers a feature-rich solution for low-power applications. The C3
Stacked-CSP memory device incorporates flash memory and static RAM in one package with
low voltage capability to achieve the smallest system memory solution form-factor together with
high-speed, low-power operations. The C3 Stacked-CSP memory device offers a protection
register and flexible block locking to enable next generation security capability. Combined with
the Intel® Flash Data Integrator (Intel® FDI) software, the C3 Stacked-CSP memory device
provides a cost-effective, flexible, code plus data storage solution.
Notice: This document contains information on new products in production. The specifications
are subject to change without notice. Verify with your local Intel sales office that you have the lat-
est datasheet before finalizing a design.
252636-001
February, 2003
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