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IXP45X Datasheet, PDF (102/148 Pages) Intel Corporation – Product Line of Network Processors
Intel® IXP45X and Intel® IXP46X Product Line of Network Processors—Datasheet
Table 26. Processors’ Ball Map Assignments (Sheet 26 of 26)
Ball
Signal Name
Pin Configurations
Processor Number
Intel® IXP465 Intel® IXP460 Intel® IXP455
AF1
VSS
X
X
X
AF2
VSS
X
X
X
AF3 UTP_OP_DATA[0] ETHA_TXDATA[0]
X
X
AF4 UTP_IP_DATA[2] ETHA_RXDATA[2]
X
X
AF5
VSS
X
X
X
AF6 UTP_IP_DATA[0] ETHA_RXDATA[0]
X
X
AF7
UTP_OP_CLK
ETHA_TXCLK
X
X
AF8
UTP_OP_ADDR[2]
X
X
AF9
UTP_OP_ADDR[0]
X
X
AF10
UTP_IP_CLK
ETHA_RXCLK
X
X
AF11
OSC_IN
X
X
X
AF12
VCCP
X
X
X
AF13
OSC_OUT
X
X
X
AF14
UTP_IP_ADDR[2]
X
X
AF15
BYPASS_CLK
X
X
X
AF16
PWRON_RESET_N
X
X
X
AF17
HIGHZ_N
X
X
X
AF18
JTG_TRST_N
X
X
X
AF19
VCCP
X
X
X
AF20
CTS1_N
X
X
X
AF21
VSS
X
X
X
AF22
GPIO[11]
X
X
X
AF23
GPIO[10]
X
X
X
AF24
GPIO[3]
X
X
X
AF25
VSS
X
X
X
AF26
Note:
Note:
Note:
VSS
X
X
X
Interfaces not being utilized at a system level may require external pull-up or pull-down resistors. For specific details and
requirements, see Section 4.2, “Functional Signal Definitions” on page 43.
Pin Configuration is set by the Expansion bus configuration when Reset is deasserted.
Blank field indicates no physical ball on package.
4.4
Package Thermal Specifications
The thermal parameters defined in Table 27, Table 28, and Table 29 are based on
simulated results of packages assembled on standard multi-layer, 2s2p, 1.0-oz copper
layer boards in a natural convection environment. The maximum case temperature is
based on the maximum junction temperature and defined by the relationship:
Tcase max = Tjmax - (ΨJT x Power)
Where ΨJT is the junction-to-package top thermal characterization parameter. If the
case temperature exceeds the specified Tcase max, thermal enhancements such as heat
sinks or forced air will be required. In the tables below, ΘJA is the package junction-to-
air thermal resistance.
Intel® IXP45X and Intel® IXP46X Product Line of Network Processors
Datasheet
102
August 2006
Document Number: 306261-004US