TLE7185-1E Datasheet, PDF (9/23 Pages) Infineon Technologies AG – 3-Phase Bridge Driver IC

TLE7185-1E
General Product Characteristics
4.3
Thermal Resistance
Note: This thermal data was generated in accordance with JEDEC JESD51 standards. For more information, go
to www.jedec.org.
Pos. Parameter
Symbol
Limit Values
Unit Conditions
Min. Typ. Max.
4.3.1 Junction to Case¹⁾
R_thJC
–
4.3.2 Junction to Ambient¹⁾
R_thJA
–
1) Not subject to production test, specified by design.
–
5
29
–
K/W –
K/W ²⁾
2) Exposed Heatslug Package use this sentence: Specified R_thJA value is according to Jedec JESD51-2,-5,-7 at natural
convection on FR4 2s2p board; The Product (Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm board with 2 inner
copper layers (2 x 70µm Cu, 2 x 35µm Cu). Where applicable a thermal via array under the exposed pad contacted the first
inner copper layer.
4.4
Table 1
Default State of Inputs
Default State of Inputs (if left open)
Characteristic
Default state of ILx
Default state of IHx
Default state of ENA
Default state of INH
Default state of STOE
State
Low
High
Low
Low
Low
Remark
Low side MOSFETs off
High side MOSFETs off
Device outputs disabled
Sleep mode, I_Q < 22 µA
Shoot through option is disabled
Note: To activate the driver both INH and ENA must be pulled high. To allow shoot through all ILx pins must be
pulled high, all IHx must be pulled low and STOE must be pulled high
Data Sheet
9
Rev. 2.4, 2010-07-16